L6225_03 STMICROELECTRONICS [STMicroelectronics], L6225_03 Datasheet - Page 3

no-image

L6225_03

Manufacturer Part Number
L6225_03
Description
DMOS DUAL FULL BRIDGE DRIVER
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
THERMAL DATA
(1)
(2)
(3)
(4)
PIN CONNECTIONS (Top View)
(5)
R
R
R
R
R
Symbol
R
SENSE
SENSE
th-j-amb1
th-j-amb1
th-j-amb1
th-j-amb2
th-j-case
OUT1
OUT1
th-j-pins
GND
GND
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the bottom side of 6cm
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
Mounted on a multi-layer FR4 PCB with a dissipating copper surface on the top side of 6cm
and a ground layer.
Mounted on a multi-layer FR4 PCB without any heat sinking surface on the board.
IN1
IN2
IN1
IN2
The slug is internally connected to pins 1,10,11 and 20 (GND pins).
A
A
A
A
B
B
B
B
MaximumThermal Resistance Junction-Pins
Maximum Thermal Resistance Junction-Case
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
MaximumThermal Resistance Junction-Ambient
Maximum Thermal Resistance Junction-Ambient
1
2
3
4
5
6
7
8
9
10
PowerDIP20/SO20
D99IN1093A
Description
20
19
18
17
16
15
14
13
12
11
EN
VCP
OUT2
VS
GND
GND
VS
OUT2
VBOOT
EN
A
B
A
B
A
B
SENSE
OUT2
OUT1
GND
GND
VCP
IN1
IN2
VS
EN
A
A
A
A
A
A
A
1
3
2
4
PowerDIP20
1
2
3
4
5
6
7
8
9
10
13
41
57
-
-
-
PowerSO20
D99IN1092A
2
2
SO20
(with a thickness of 35µm), 16 via holes
(with a thickness of 35µm).
15
52
78
-
-
-
2
(with a thickness of 35µm).
(5)
20
19
18
17
16
15
14
13
12
11
PowerSO20
36
16
63
2
-
-
GND
VS
OUT2
VBOOT
EN
IN2
IN1
SENSE
OUT1
GND
B
B
B
B
B
B
L6225
B
Unit
C/W
C/W
C/W
C/W
C/W
C/W
3/20

Related parts for L6225_03