ISL41334 INTERSIL [Intersil Corporation], ISL41334 Datasheet - Page 7

• Manufacturer Part Number: ISL41334
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
V
V
Input Voltages
Input/Output Voltages
Output Short Circuit Duration
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
DC CHARACTERISTICS - RS-485 DRIVER (SEL = V
Driver Differential V
Driver Differential V
Change in Magnitude of Driver
Differential V
Complementary Output States
Driver Common-Mode V
Change in Magnitude of Driver
Common-Mode V
Complementary Output States
Driver Short-Circuit Current,
V
Driver Three-State Output
Leakage Current (Y, Z)
DC CHARACTERISTICS - RS-232 DRIVER (SEL = GND)
Driver Output Voltage Swing
Driver Output Short-Circuit Current
DC CHARACTERISTICS - LOGIC PINS (i.e., DRIVER AND CONTROL INPUT PINS)
Input High Voltage
3. One output at a time, I
4. QFN θ
CC
L
All Except A, B (non-QFN Package) . . . . . -0.5V to (V
All Except A, B (QFN Package) . . . . . . . . . . -0.5V to (V
A, B (Any Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -25V to +25V
Y, Z (Any Mode, Note 3) . . . . . . . . . . . . . . . . . . . -12.5V to +12.5V
R
R
Y, Z, R
OUT
(QFN Only) . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to V
A
A
θ
TB379 and Tech Brief TB389 for details.
to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
, R
, R
JA
= High or Low
B
B
for other packages is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief
A
(non-QFN Package). . . . . . . . . . . . -0.5V to (V
(QFN Package) . . . . . . . . . . . . . . . . -0.5V to (V
, R
JA
PARAMETER
B
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
OUT
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Indefinite
OUT
for
OUT
OUT
for
(with load)
(no load)
OUT
OUT
≤ 100mA for ≤ 10 mins.
7
Test Conditions: V
Typicals are at V
(T
SYMBOL
A
V
V
V
∆V
∆V
V
V
V
V
I
I
I
V
= 25°C)
OD1
OD2
OD3
OS
OS
OZ
IH1
IH2
IH3
OC
OD
OC
O
R = 50Ω (RS-422) (Figure 1)
R = 27Ω (RS-485) (Figure 1)
R
R = 27Ω or 50Ω (Figure 1)
R = 27Ω or 50Ω (Figure 1) (Note 9)
R = 27Ω or 50Ω (Figure 1) (Note 9)
-7V ≤ (V
Outputs Disabled,
V
All T
V
V
V
V
CC
OUT
L
L
L
D
CC
= V
= 3.3V (QFN Only)
= 2.5V (QFN Only)
CC
= 60Ω, R = 375Ω, V
OUTS
CC
= 0V or 5.5V
= 5V, T
CC
CC
= 0V
ISL81334, ISL41334
CC
= 4.5V to 5.5V, C1 - C4 = 0.1
CC
)
L
L
Y
+ 0.5V)
+ 0.5V)
+ 0.5V)
+ 0.5V)
or V
if QFN
+ 0.5V
Loaded with 3kΩ to Ground
A
= 25°C (Note 5)
Z
TEST CONDITIONS
) ≤ 12V (Note 7)
CM
= -7V to 12V (Figure 1)
Thermal Information
Thermal Resistance (Typical, Note 4)
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to 85°C
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . .
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . .
40 Ld QFN Package. . . . . . . . . . . . . . . . . . . . . . . . .
(SOIC and SSOP - Lead Tips Only)
V
V
µ
OUT
OUT
F, V
L
= 12V
= -7V
= V
CC
(for QFN only); Unless Otherwise Specified.
TEMP
(°C)
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
-200
MIN
±5.0
2.5
2.2
-60
1.5
35
2
2
2
-
-
-
-
-
25/-35
+6/-7
TYP
0.01
0.01
3.1
2.7
2.7
1.6
1.2
1
-
-
-
-
-
MAX
V
December 20, 2005
250
500
0.2
3.1
0.2
60
CC
5
5
-
-
-
-
-
-
θ
JA
UNITS
FN6202.1
(°C/W)
65
60
32
mA
mA
µA
µA
V
V
V
V
V
V
V
V
V
V
V