LAN8187_06 SMSC [SMSC Corporation], LAN8187_06 Datasheet - Page 72
LAN8187_06
Manufacturer Part Number
LAN8187_06
Description
Manufacturer
SMSC [SMSC Corporation]
Datasheet
1.LAN8187_06.pdf
(72 pages)
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±15kV ESD Protected MII/RMII Fast-Ethernet PHY with HP Auto-MDIX and SMSC flexPWR
Datasheet
Chapter 9 Package Outline
SMSC LAN8187/LAN8187I
ccc
A1
A2
E1
R2
L1
D1
W
A
D
E
H
R
L
e
θ
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Figure 9.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 12x12 mm Footprint
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
Table 9.1 64 Pin TQFP Package Parameters
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
72
TM
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Length
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
Revision 1.0 (12-14-06)
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