MCP2210 MICROCHIP [Microchip Technology], MCP2210 Datasheet - Page 65

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MCP2210

Manufacturer Part Number
MCP2210
Description
USB-to-SPI Protocol Converter with GPIO (Master Mode)
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet

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TABLE 4-2:
 2011 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C  T
Param
Note 1:
TH01
TH02
TH03
TH04
TH05
TH06
TH07
No.
2:
3:
P
INTERNAL
I
T
T
T
DD
P
Sym
A
P
J
θ
θ
JMAX
PD
DER
JC
I
= Ambient Temperature.
= Junction Temperature.
JA
/
is the current to run the chip alone without driving any load on the output pins.
O
THERMAL CONSIDERATIONS
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to
Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
Characteristic
A
 +85C (I-Temp)
108.1
85.2
36.1
Typ
150
1.7
24
24
Units
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5 mm package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5 mm package
PD = P
P
P
V
P
OH
INTERNAL
I
DER
/
O
))
=  (I
= PD
INTERNAL
OL
= I
MAX
Conditions
* V
MCP2210
DD
(T
OL
+ P
x V
J
) +  (I
- T
DS22288A-page 65
I
DD (1)
/
O
A
)/θ
OH
JA (2,3)
* (V
DD

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