NG80960JA-16 INTEL [Intel Corporation], NG80960JA-16 Datasheet - Page 36

• Manufacturer Part Number: NG80960JA-16
• Description: EMBEDDED 32-BIT MICROPROCESSOR
• Manufacturer: INTEL [Intel Corporation]

80960JA/JF/JD/JT 3.3 V Microprocessor
Table 14.
Table 15.
36
132-Lead PQFP Package Thermal Characteristics
Maximum T
NOTES:
1. This table applies to a PQFP device soldered directly into board.
2.
3.
4.
NOTES:
JC
CA
Package
Package
Package
1. 0.248” high omnidirectional heatsink (AI alloy 6061, 41 mil fin width, 124 mil center-to-center fin spacing).
2. 0.250” high unidirectional heatsink (AI alloy 6061, 50 mil fin width, 146 mil center-to-center fin spacing).
MPBGA
PQFP
(Junction-to-Case)
PGA
(Case-to-Ambient -No Heatsink)
JA
JL
JB
= 13°C/W (approx.)
=
= 13.5°C/W (approx.)
JC
Parameter
T
T
T
Heatsink
T
Heatsink
T
+
A
A
A
A
A
A
at Various Airflows in °C (80960JT)
without Heatsink
without Heatsink
with Omnidirectional
with Unidirectional
without Heatsink
CA
1
2
Thermal Resistance — °C/Watt
4.1
(0)
23
0
f
CLKIN
33
25
33
25
33
25
33
25
33
25
(MHz)
(0.25)
JB
JA
4.3
50
19
JC
TBD
TBD
(0)
62
71
58
68
75
81
73
79
0
Airflow — ft./min (m/sec)
(0.50)
JL
CA
100
4.3
18
(1.01)
TBD
TBD
200
73
79
68
75
85
88
86
90
Advance Information Datasheet
(1.01)
200
4.3
Airflow-ft/min (m/sec)
16
(2.03)
TBD
TBD
400
76
82
76
82
90
92
90
92
(2.03)
400
4.3
14
(3.04)
TBD
TBD
600
81
86
80
84
92
94
92
94
(3.04)
600
4.7
11
(4.06)
TBD
TBD
800
85
88
81
86
93
95
93
95
(4.06)
800
4.9
9
(5.07)
1000
TBD
TBD
88
91
83
87
93
95
93
95