MPC8308CVMADDA FREESCALE [Freescale Semiconductor, Inc], MPC8308CVMADDA Datasheet - Page 79

• Manufacturer Part Number: MPC8308CVMADDA
• Description: MPC8308 PowerQUICC II Pro Processor Hardware Specification
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

22 Thermal
This section describes the thermal specifications of the device.
22.1
Table 59
Freescale Semiconductor
Junction to Ambient Natural Convection
Junction to Ambient Natural Convection
Junction to Ambient (@200 ft/min)
Junction to Ambient (@200 ft/min)
Junction to Board
Junction to Case
Junction to Package Top
1
2
Note:
For any core_clk:csb_clk ratios, the core_clk must not exceed its maximum operating frequency of 333 MHz.
Core VCO frequency = core frequency × VCO divider. Note that VCO divider has to be set properly so that the
core VCO frequency is in the range of 400–800 MHz.
0–1
10
10
00
01
RCWL[COREPLL]
provides the package thermal characteristics for the 473, 19 × 19 mm MAPBGA.
Thermal Characteristics
Characteristic
0010
0011
0011
0011
2–5
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 0
6
1
0
0
0
Table 59. Package Thermal Characteristics for MAPBGA
Table 58. e300 Core PLL Configuration (continued)
core_clk: csb_clk Ratio
2.5:1
3:1
3:1
3:1
Four layer board (2s2p)
Four layer board (2s2p)
Single layer board (1s)
Single layer board (1s)
Natural Convection
Board Type
—
—
1
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJA
θJA
θJB
θJC
JT
VCO Divider (VCOD)
Value
8
2
4
8
42
27
35
24
17
9
2
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Thermal
Notes
1,2,3
1,2
1,3
1,3
4
5
6
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