MPC8270 MOTOROLA [Motorola, Inc], MPC8270 Datasheet - Page 57

• Manufacturer Part Number: MPC8270
• Description: PowerQUICC II Family Hardware Specifications
• Manufacturer: MOTOROLA [Motorola, Inc]

Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
MOTOROLA
Not to Scale
Plated substrate via
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1 mm pitch
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Transfer molding compound
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Figure 15. Pinout of the 516 PBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications
Figure 16. Side View of the PBGA Package Remove
attach
Die
DIE
Ball bond
Wire bonds
Screen-printed
solder mask
Cu substrate traces
BT resin glass epoxy
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Pinout
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