STPC0310BTI3 STMICROELECTRONICS [STMicroelectronics], STPC0310BTI3 Datasheet - Page 45

• Manufacturer Part Number: STPC0310BTI3
• Description: PC Compatible Embeded Microprocessor
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformely
spread throughout the moulding increasing heat
dissipation through the peripheral ground balls.
Figure 6-4. Optimum layout for central ground ball
Figure 6-5. Global ground layout for good thermal dissipation
Issue 1.2
The more via pads are connected to each ground
ball, the more heat is dissipated . The only limita-
tion is the risk of lossing routing channels.
Figure 6-5 shows a routing with a good trade off
between thermal dissipation and number of rout-
ing channels.
Clearance = 6mil
External diameter = 37 mil
Via to Ground layer
hole diameter = 14 mil
Solder mask
diameter = 33 mil
Pad for ground ball
diameter = 25 mil
connections = 10 mil
Via to ground layer
Ground pad
BOARD LAYOUT
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