CY8C20110_12 CYPRESS [Cypress Semiconductor], CY8C20110_12 Datasheet - Page 41

• Manufacturer Part Number: CY8C20110_12
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document History Page
Document Number: 001-54606 Rev. *G
Document Title: CY8C20110/CY8C20180/CY8C20160/CY8C20140/CY8C20142, CapSense
Controllers
Document Number: 001-54606
Rev.
*C
*D
*A
*B
*E
*F
**
2741726
2821828
2892629
3002214
3042142
3085081
3276234
ECN
Change
Orig. of
SSHH /
SLAN /
ARVM
ARVM
SLAN
FSU
FSU
NJF
NJF
Submission
07/21/2009
03/15/2010
07/29/2010
12/4/2009
09/30/10
11/12/10
06/07/11
Date
Updated
New data sheet.
Added Contents.
Updated
and their details).
Updated
(Updated
Updated
dimensions for mounting QFN packages, see the "Application Notes for
Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages"
available at http://www.amkor.com.” below the column).
Updated
parameters and their details).
Updated
16-pin QFN).
Updated
CY8C20110).
Added
Minor edits across the document.
Updated
GP1[1] and GP1[2] pins).
Updated
GP1[1] and GP1[2] pins).
Updated
GP1[1] and GP1[2] pins).
Updated
and their details).
Updated
(Added
Updated
Updated in new template.
Updated
(Updated
I
AC Electrical Specifications
Figure 12
for clearer understanding.)))).
Updated
Added
Updated in new template.
“Overlay thickness-buttons” category),
added the following statement after
“The Recommended maximum overlay thickness is 5 mm (with external CS
2 mm (without external CS
Integrating Capacitor (Cint)” in AN53490.
Note Some device packages does not have CS
cannot be connected.”).
Updated
thickness”).
Updated
2
C Line with 1.8 V External Pull-up”), added
Acronyms
Reference Documents
AC Chip-Level Specifications
Absolute Maximum Ratings
Absolute Maximum Ratings
Electrical Specifications
Pin Definitions
Absolute Maximum Ratings
Package Diagrams
Features
Pin Definitions
Pin Definitions
Pin Definitions
Electrical Specifications
Typical Circuits
Electrical Specifications
Solder Reflow Specifications
Layout Guidelines and Best Practices
CapSense Constraints
Solder Reflow Specifications
DC Flash Write Specifications
DC GPIO Specifications
(No specific changed were made to I2C Timing Diagram. Updated
and
(Changed the part number from CY8C21110 to
Units of
(Added a Note “For information on the preferred
(Added Note
(Added Note
(Added Note
(Updated
Description of Change
Int
(Updated
). For more details refer to the section “The
(Updated
and Glossary.
Measure.
(Removed the parameter “Overlay
(Updated
(Updated
(Updated
(Removed sub-section “2.7-V DC Spec for
Figure 4
Table 2
(Removed F32k u, t
CY8C20160, CY8C20140
(Added F32k u, t
(Added T
CY8C20110, CY8C20180
3
6
7
section)).
AC I
(Updated
(Updated
Figure 1
and referred the same Note in all
and referred the same Note in all
and referred the same Note in all
(Updated Note 23))).
®
2
DC Electrical Specifications
AC Electrical Specifications
DC Electrical Specifications
C Specifications
–
(Replaced with updated one)).
Express™ Button Capacitive
DC I2C
BAKETEMP
(Updated
Int
(Changed 16-pin COL to
Table
Table
pin and external capacitor
Specifications)), updated
POWERUP
16).
16).
POWERUP
and T
Table 2
CY8C20142
(Updated
BAKETIME
Page 41 of 43
parameters
parameters
(Removed
Int)
/