MK61FX512VMD12 FREESCALE [Freescale Semiconductor, Inc], MK61FX512VMD12 Datasheet - Page 24

• Manufacturer Part Number: MK61FX512VMD12
• Description: K61 Sub-Family
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

General
5.4 Thermal specifications
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
1.
24
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
—
Board type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Table 11. Thermal operating requirements
K61 Sub-Family Data Sheet, Rev. 4, 10/2012.
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (natural
convection)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to ambient (200 ft./
min. air speed)
Thermal
resistance, junction
to board
Thermal
resistance, junction
to case
Thermal
characterization
parameter, junction
to package top
outside center
(natural
convection)
Description
50
30
41
27
17
10
2
144 MAPBGA
Min.
–40
–40
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
Max.
125
105
1
1
1
1
2
3
4
Notes
Unit
°C
°C