DAC1403D160HW NXP [NXP Semiconductors], DAC1403D160HW Datasheet

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DAC1403D160HW

Manufacturer Part Number
DAC1403D160HW
Description
Dual 14 bits DAC, up to 160 MHz, 2 x interpolating
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.DAC1403D160HW.pdf (19 pages)

Available stocks

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Manufacturer
Quantity
Price
Company:
BOSTOCK HK LIMITED BOSTOCK HK LIMITED
Part Number:
DAC1403D160HW/C1,5
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
Company:
BOSTOCK HK LIMITED BOSTOCK HK LIMITED
Part Number:
DAC1403D160HW/C1:5
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
1. General description
2. Features
3. Applications
The DAC1403D160 is optimized to reduce architecture complexity and overall system
cost. It leads to dynamic performance in multi-carrier support, because of its direct IF
conversion capabilities. With an internal sampling rate of up to 160 MHz, DAC1403D160
is an extremely competitive solution for broadband wireless systems transmitters, as well
as a wide range of applications.
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DAC1403D160
Dual 14 bits DAC, up to 160 MHz, 2 x interpolating
Rev. 02 — 14 August 2008
Dual 14-bit resolution
Spurious-Free Dynamic Range (SFDR) = 80 dBc at 2.5 MHz
Input data rate up to 80 MHz
2
Output data rate up to 160 MHz
Single 3.3 V power supply
Low noise capacitor-free integrated Phase-Locked Loup (PLL)
Low power dissipation
HTQFP80 package
Ambient temperature from 40 C to +85 C
Broadband wireless systems
Digital radio links
Cellular base stations
Instrumentation
Cable modem
Cable Modem Termination System (CMTS)/Data Over Cable Service Interface
Specification (DOCSIS)
interpolation filter
Product data sheet

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DAC1403D160HW Summary of contents

Page 1

DAC1403D160 Dual 14 bits DAC 160 MHz interpolating Rev. 02 — 14 August 2008 1. General description The DAC1403D160 is optimized to reduce architecture complexity and overall system cost. It leads to dynamic performance in multi-carrier ...

Page 2

... NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name DAC1403D160HW HTQFP80 5. Block diagram (1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78. ...

Page 3

... V CCA AGND CLK CLKN AGND i.c. DGND DAC1403D160_2 Product data sheet Dual 14 bits DAC 160 MHz interpolating DAC1403D160HW I13 11 I12 12 13 I11 I10 DGND Pin description [1] Pin Type Description ...

Page 4

NXP Semiconductors Table 2. Symbol V CCD I13 I12 I11 I10 I9 I8 DGND DEC DGND DEC I1 I0 DGND DGND Q13 Q12 Q11 Q10 DGND DEC DEC ...

Page 5

NXP Semiconductors Table 2. Symbol V CCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES V CCA AGND DEC AGND V CCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND V CCA AGND DEC AGND V CCA ...

Page 6

NXP Semiconductors 7. Functional description The Digital-to-Analog Converter (DAC segmented architecture composed of a 7-bit thermometer sub-DAC and the remaining 7-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins ...

Page 7

NXP Semiconductors 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CCD V CCA stg T amb T j [1] All supplies are connected together. ...

Page 8

NXP Semiconductors 10. Characteristics Table 5. Characteristics 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure ...

Page 9

NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; ...

Page 10

NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(fs) Figure 10; ...

Page 11

NXP Semiconductors 20 output (dB 100 140 180 0 0.2 0.4 normalized frequency (f Fig 6. FIR filter frequency response Table 7. Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) ...

Page 12

NXP Semiconductors 11. Application information R s CLK V CCA 1 k CLKN 100 nF AGND 014aaa516 Fig 8. Single-ended clock schematic DAC1403D160_2 Product data sheet Dual 14 bits DAC 160 MHz ...

Page 13

NXP Semiconductors AGND 3 CCA 1 3 CCA 3 3 ...

Page 14

NXP Semiconductors 11.1 Alternative parts The following alternative parts are also available: Table 8. Type number DAC1203D160 DAC1003D160 [1] Pin to pin compatible DAC1403D160_2 Product data sheet Dual 14 bits DAC 160 MHz interpolating Alternative parts ...

Page 15

NXP Semiconductors 12. Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body mm; exposed die pad y exposed die pad pin 1 index ...

Page 16

NXP Semiconductors 13. Abbreviations Table 9. Acronym BW FIR IF LSB MSB PLL PMOS 14. Glossary 14.1 Static parameters DNL — Differential Non-Linearity. The difference between the ideal and the measured output value between successive DAC codes. INL — Integral ...

Page 17

NXP Semiconductors 15. Revision history Table 10. Revision history Document ID Release date DAC1403D160_2 20080814 • Modifications: Corrections made to row Q0 in • Added condition & correction of value to t • Additional definition in DAC1403D160_1 20080616 DAC1403D160_2 Product ...

Page 18

NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 19

NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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