DAC1205D650HW/C1 NXP [NXP Semiconductors], DAC1205D650HW/C1 Datasheet - Page 2

• Manufacturer Part Number: DAC1205D650HW/C1
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
3. Applications
4. Ordering information
Table 1.
DAC1205D650_1
Product data sheet
Type number
DAC1205D650HW/C1
Ordering information
I
I
I
I
I
I
I
Package
Name
HTQFP100
Wireless infrastructure: LTE, WiMAX, GSM, CDMA, WCDMA, TD-SCDMA
Communication: LMDS/MMDS, point-to-point
Direct Digital Synthesis (DDS)
Broadband wireless systems
Digital radio links
Instrumentation
Automated Test Equipment (ATE)
Description
plastic thermal enhanced thin quad flat package; 100 leads;
body 14
Rev. 01 — 28 July 2009
14
Dual 12-bit DAC, up to 650 Msps; 2 4 and 8 interpolating
1 mm; exposed die pad
DAC1205D650
© NXP B.V. 2009. All rights reserved.
Version
SOT638-1
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