PCA9673BQ PHILIPS [NXP Semiconductors], PCA9673BQ Datasheet
PCA9673BQ
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PCA9673BQ Summary of contents
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PCA9673 Remote 16-bit I/O expander for Fm+ I reset Rev. 01 — 1 February 2007 1. General description The PCA9673 provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I family. The PCA9673 is ...
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... Name PCA9673D PCA9673D SO24 PCA9673DB PCA9673DB SSOP24 PCA9673DK PCA9673 SSOP24 PCA9673PW PCA9673PW TSSOP24 PCA9673BQ 9673 DHVQFN24 plastic dual in-line compatible thermal enhanced very thin quad PCA9673BS 9673 HVQFN24 [1] Also known as QSOP24. PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm+ I Description plastic small outline package ...
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NXP Semiconductors 5. Block diagram INT AD0 AD1 SCL SDA RESET Fig 1. Block diagram of PCA9673 data from Shift Register data to Shift Register Fig 2. Simplified schematic diagram of P00 to P17 PCA9673_1 Product ...
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NXP Semiconductors 6. Pinning information 6.1 Pinning RESET Fig 3. Pin configuration for SO24 RESET Fig 5. Pin configuration for SSOP24 PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm INT V DD AD1 2 23 ...
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... Rev. 01 — 1 February 2007 PCA9673 2 C-bus with interrupt and reset terminal 1 index area AD1 2 3 RESET P00 4 P01 5 6 P02 PCA9673BQ 7 P03 P04 8 P05 9 10 P06 P07 11 Transparent top view Fig 8. Pin configuration for DHVQFN24 Description interrupt output (active LOW) address input 1 ...
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NXP Semiconductors Table 2. Symbol SCL SDA V DD [1] HVQFN and DHVQFN package die supply ground is connected to both the V pad. The V electrical, and board-level performance, the exposed pad needs to be soldered to the board ...
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NXP Semiconductors 7.1.1 Address maps Table 3. AD1 SCL SCL SDA SDA SCL SCL SDA SDA 7.2 Software Reset call, and Device ID addresses ...
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NXP Semiconductors 7.2.1 Software Reset The Software Reset Call allows all the devices in the I state value through a specific formatted I implies that the I The Software Reset sequence is defined as following START command is ...
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NXP Semiconductors • 3 bits with the die revision, assigned by manufacturer (for example, Rev X). The Device ID is read-only, hardwired in the device and can be accessed as follows: 1. START command 2. The master sends the Reserved ...
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NXP Semiconductors S 1 START condition M7 manufacturer name = 00000000 Fig 14. Device ID field reading 8. I/O programming 8.1 Quasi-bidirectional I/O architecture The PCA9673’s 16 ports (see as input or output ports. Input data is transferred from the ...
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NXP Semiconductors first data byte is acknowledged by the PCA9673, the second data byte P17 to P10 is sent by the master. Once again, the PCA9673 acknowledges the receipt of the data. Each 8-bit data is presented on the port ...
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SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 data into port 0 DATA 00 ...
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SCL P0x SDA DATA 00 START condition R/W acknowledge from slave read from port 0 t h(D) data into port 0 ...
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NXP Semiconductors 8.4 Power-on reset When power is applied reset condition until V and the PCA9673 registers and I states. Thereafter V 8.5 Interrupt output (INT) The PCA9673 provides an open-drain interrupt (INT) which can be fed ...
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NXP Semiconductors 9. Characteristics of the I 2 The I C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be ...
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NXP Semiconductors SDA SCL MASTER TRANSMITTER/ RECEIVER Fig 22. System configuration 9.3 Acknowledge The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed ...
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NXP Semiconductors 10. Application design-in information 10.1 Bidirectional I/O expander applications In the 8-bit I/O expander application shown in to P07 are outputs. When used in this configuration, during a write, the input (P00 and P01) must be written as ...
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NXP Semiconductors 10.3 Differences between the PCA9673 and the PCF8575 The PCA9673 is a drop in replacement for the PCF8575 and can used without electrical or software modifications, but there is a difference in interrupt output release timing during the ...
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NXP Semiconductors 12. Static characteristics Table 5. Static characteristics Symbol Parameter Supplies V supply voltage DD I supply current DD I standby current stb V power-on ...
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NXP Semiconductors [1] The power-on reset circuit resets the I [2] Each bit must be limited to a maximum and the total package limited to 400 mA due to internal busing limits. [3] The value is not ...
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NXP Semiconductors [ time for Acknowledgement signal from SCL LOW to SDA (out) LOW. VD;ACK [ minimum time for SDA data out to be valid following SCL LOW. VD;DAT [ total capacitance of one ...
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NXP Semiconductors 14. Package outline SO24: plastic small outline package; 24 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 5 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. ...
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NXP Semiconductors TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm ...
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NXP Semiconductors SSOP24: plastic shrink small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) A UNIT ...
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NXP Semiconductors HVQFN24: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 0.85 mm terminal 1 index area terminal 1 24 index area DIMENSIONS (mm are ...
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NXP Semiconductors DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm terminal 1 index area terminal 1 index area ...
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NXP Semiconductors 15. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling integrated circuits. 16. Soldering This text provides a very brief insight ...
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NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities ...
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NXP Semiconductors Fig 34. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 9. Acronym CDM CMOS ESD GPIO HBM 2 I ...
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NXP Semiconductors 18. Revision history Table 10. Revision history Document ID Release date PCA9673_1 20070201 PCA9673_1 Product data sheet Remote 16-bit I/O expander for Fm+ I Data sheet status Product data sheet Rev. 01 — 1 February 2007 PCA9673 2 ...
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NXP Semiconductors 19. Legal information 19.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...