PCA9600D NXP [NXP Semiconductors], PCA9600D Datasheet - Page 27
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PCA9600D
Manufacturer Part Number
PCA9600D
Description
Dual bidirectional bus buffer
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PCA9600D.pdf
(30 pages)
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13. Abbreviations
PCA9600_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 10.
Acronym
CDM
ESD
HBM
I
I/O
IC
MM
PMBus
SMBus
TTL
2
Fig 28. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Charged-Device Model
ElectroStatic Discharge
Human Body Model
Inter-Integrated Circuit bus
Input/Output
Integrated Circuit
Machine Model
Power Management Bus
System Management Bus
Transistor-Transistor Logic
Rev. 04 — 11 November 2009
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Dual bidirectional bus buffer
temperature
peak
PCA9600
© NXP B.V. 2009. All rights reserved.
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