TDA8922 PHILIPS [NXP Semiconductors], TDA8922 Datasheet - Page 2

• Manufacturer Part Number: TDA8922
• Description: 2 x 25 W class-D power amplifier
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.3
8.3.1
8.3.2
8.3.3
8.3.4
8.4
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
16.5
16.6
16.7
16.8
16.9
16.10
16.11
16.12
16.13
2003 Mar 20
2
25 W class-D power amplifier
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Pulse width modulation frequency
Protections
Overtemperature
Short-circuit across loudspeaker terminals and
to supply lines
Start-up safety test
Supply voltage alarm
Differential audio inputs
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
STATIC CHARACTERISTICS
SWITCHING CHARACTERISTICS
DYNAMIC AC CHARACTERISTICS (STEREO
AND DUAL SE APPLICATION)
DYNAMIC AC CHARACTERISTICS (MONO
BTL APPLICATION)
APPLICATION INFORMATION
BTL application
Pin MODE
Output power estimation
External clock
Heatsink requirements
Output current limiting
Pumping effects
Reference design
PCB information for HSOP24 package
Classification
Bill of materials for reference design
Curves measured in reference design
Application schematics
2
17
18
18.1
18.2
18.2.1
18.2.2
18.3
18.3.1
18.3.2
18.3.3
18.4
19
20
21
PACKAGE OUTLINE
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
Objective specification
TDA8922