TDA8920BJ PHILIPS [NXP Semiconductors], TDA8920BJ Datasheet
TDA8920BJ
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TDA8920BJ Summary of contents
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TDA8920B 2 Rev. 01 — 1 October 2004 1. General description The TDA8920B is a high efficiency class-D audio power amplifier with very low dissipation. The typical output power is 2 The device is available in the HSOP24 power package ...
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... Stereo single-ended configuration P o Mono bridge-tied load configuration Ordering information Table 2: Type number TDA8920BTH TDA8920BJ 9397 750 13356 Preliminary data sheet Quick reference data Conditions = supply voltage total quiescent no load; no filter; no RC-snubber supply current network connected ...
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... SGND2 mute 5 (22) IN2P INPUT 4 (21) STAGE IN2M 1 (18 SSA2 SSA1 Pin numbers in parenthesis refer to the TDA8920BJ. Fig 1. Block diagram. 9397 750 13356 Preliminary data sheet STABI PROT 18 (12) 13 (7) RELEASE1 PWM SWITCH1 CONTROL MODULATOR ENABLE1 HANDSHAKE STABI ...
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... OSC 8 IN1P 9 IN1M 10 V DDA1 11 SGND1 12 V SSA1 001aab217 Fig 3. Pin configuration TDA8920BJ. Pin description Description TDA8920BTH TDA8920BJ 1 18 negative analog supply voltage for channel signal ground for channel positive analog supply voltage for channel negative audio input for channel 2 ...
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... Mono Bridge-Tied Load (BTL) amplifier • Stereo Single-Ended (SE) amplifiers. 9397 750 13356 Preliminary data sheet Pin description …continued Description TDA8920BTH TDA8920BJ 11 5 signal ground for channel negative analog supply voltage for channel decoupling capacitor for protection (OCP) ...
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Philips Semiconductors The amplifier system can be switched in three operating modes with pin MODE: • Standby mode; with a very low supply current • Mute mode; the amplifiers are operational; but the audio signal at the output is suppressed ...
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Philips Semiconductors Fig 5. Timing on mode selection input. 9397 750 13356 Preliminary data sheet V mode 50 % duty cycle 4.2 V mute 2 mode standby 0 V (SGND) 100 ms V mode 50 % ...
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Philips Semiconductors 8.2 Pulse width modulation frequency The output signal of the amplifi PWM signal with a carrier frequency of approximately 317 kHz. Using a 2nd-order LC demodulation filter in the application results in an analog audio signal ...
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Philips Semiconductors In case of an impedance drop (e.g. due to dynamic behavior of the loudspeaker) the same protection will be activated; the maximum output current is again limited but the amplifier will NOT switch-off completely (thus ...
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Philips Semiconductors 8.3.3 Window Protection (WP) During the start-up sequence, when pin MODE is switched from standby to mute, the conditions at the output terminals of the power stage are checked. In the event of a short-circuit at one of ...
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Philips Semiconductors [2] Only complete shut-down of amplifier if short-circuit impedance is below threshold all other cases current limiting: resulting in clipping output signal. [3] Fault condition detected during (every) transition between standby-to-mute and during restart ...
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... Preliminary data sheet Thermal characteristics Parameter thermal resistance from junction to ambient TDA8920BTH TDA8920BJ thermal resistance from junction to case TDA8920BTH TDA8920BJ Section 13.5. Conditions no load, no filter; no snubber network connected mute and operating; with respect to V Rev. 01 — 1 October 2004 ...
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Philips Semiconductors Table 7: Static characteristics 317 kHz unless otherwise specified. P osc amb Symbol Parameter Temperature protection T temperature protection activation prot T hysteresis on temperature protection hys [1] ...
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Philips Semiconductors 12.2 Stereo and dual SE application Table 9: Stereo and dual SE application characteristics kHz Symbol Parameter P output power o THD total ...
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Philips Semiconductors 12.3 Mono BTL application Table 10: Mono BTL application characteristics kHz Symbol Parameter P output power o THD total harmonic distortion G closed ...
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Philips Semiconductors 13.2 MODE pin For pop-noise free start- time-constant must be applied on the MODE pin. The bias-current setting of the VI-converter input is directly related to the voltage on the MODE pin. In turn the bias-current ...
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Philips Semiconductors If two or more class-D amplifiers are used in the same audio application strongly recommended that all devices run at the same switching frequency. This can be realized by connecting all OSC pins together and feed ...
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Philips Semiconductors (1) R (2) R (3) R (4) R (5) R Fig 8. Derating curves for power dissipation as a function of maximum ambient 13.6 Output current limiting To guarantee the robustness of the class-D amplifier the maximum output ...
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Philips Semiconductors A typical value for the capacitor on the PROT pin is 220 pF. After a fixed time of 100 ms the amplifier is switched on again. If the requested output current is still too high the amplifier will ...
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Philips Semiconductors 13.8 Application schematic Notes to the application schematic: • A solid ground plane around the switching amplifier is necessary to prevent emission. • 100 nF capacitors must be placed as close as possible to the power supply pins ...
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L1 BEAD CON1 100 nF 47 F/35 V 470 F/ GND 100 nF 47 F/35 V 470 F/ BEAD ...
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Philips Semiconductors 13.9 Curves measured in reference design 2 10 (THD N)/S (%) configuration kHz. ...
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Philips Semiconductors 2 10 (THD N)/S (%) ( ( configuration out ( ...
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Philips Semiconductors 0 cs (dB (1) (2) 80 100 configuration out ( out Fig 18. ...
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Philips Semiconductors 200 P o (W) 160 120 kHz. ( BTL configuration. ( BTL configuration. ( configuration. ( configuration. Fig 22. ...
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Philips Semiconductors 0 SVRR (dB (1) 60 (2) 80 100 (p-p). p ripple (1) both supply lines rippled. (2) one supply line rippled. Fig 26. ...
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Philips Semiconductors 15. Package outline HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height pin 1 index DIMENSIONS (mm are the original dimensions) A (1) UNIT ...
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Philips Semiconductors DBS23P: plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm DIMENSIONS (mm are the original dimensions) (1) UNIT 4.6 1.15 1.65 ...
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Philips Semiconductors 16. Soldering 16.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 ...
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Philips Semiconductors – for packages with a thickness – for packages with a thickness < 2.5 mm and a volume thick/large packages. • below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < ...
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Philips Semiconductors 16.4 Package related soldering information Table 11: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Package Through-hole mount CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [4] Through-hole-surface PMFP mount Surface mount BGA, HTSSON..T ...
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Philips Semiconductors 17. Revision history Table 12: Revision history Document ID Release date TDA8920B_1 20041001 9397 750 13356 Preliminary data sheet Data sheet status Change notice Preliminary data sheet - Rev. 01 — 1 October 2004 TDA8920B 2 100 W ...
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Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 23. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...