TDA8777HL/14/C1 PHILIPS [NXP Semiconductors], TDA8777HL/14/C1 Datasheet
TDA8777HL/14/C1
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TDA8777HL/14/C1 Summary of contents
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TDA8777 Triple 10-bit video DAC 330 MHz sample frequency Rev. 03 — 15 August 2005 1. General description The TDA8777 consists of three separate 10-bit video Digital-to-Analog Converters (DACs) with complementary outputs. They convert the digital input signals ...
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... INL DNL f CLK P tot Ordering information Table 2: Type number TDA8777HL/14/C1 LQFP48 TDA8777HL/24/C1 TDA8777HL/33/C1 TDA8777_3 Preliminary data sheet Triple 10-bit video DAC 330 MHz sample frequency Quick reference data Parameter analog supply voltage analog supply current integral non-linearity differential non-linearity ...
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Philips Semiconductors 6. Block diagram 30 V DDA3 29 V DDA2 13 V DDA1 48-39 10 red digital inputs (bits R9 to R0) 10-1 10 green digital inputs (bits G9 to G0) 23-14 10 blue digital inputs (bits B9 to ...
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Philips Semiconductors 7. Pinning information 7.1 Pinning Fig 2. Pin configuration 7.2 Pin description Table 3: Symbol BLANK SYNC V DDA1 TDA8777_3 Preliminary data sheet Triple 10-bit ...
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Philips Semiconductors Table 3: Symbol CLK V SSA1 V SSA2 OUTB OUTB V DDA2 V DDA3 OUTG OUTG OUTR OUTR COMP VREF RSET PSAVE ...
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Philips Semiconductors An external reference resistor must be connected between pin RSET and analog ground. This resistor sets the reference current which determines the analog output level, and is specifi 560 . This value allows ...
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Philips Semiconductors 10. Thermal characteristics Table 5: Thermal characteristics Symbol Parameter R thermal resistance from junction to ambient th(j-a) 11. Characteristics Table 6: Characteristics Typical values measured at V DDA Symbol Parameter Supplies V analog supply voltage DDA I analog ...
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Philips Semiconductors Table 6: Characteristics …continued Typical values measured at V DDA Symbol Parameter THD total harmonic distortion SFDR spurious-free dynamic range to Nyquist limit Outputs V output voltage compliance O(compl) Z output impedance OUT C output capacitance OUT TDA8777_3 ...
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... Philips Semiconductors Table 6: Characteristics …continued Typical values measured 3 DDA Symbol Parameter Timing f clock frequency CLK TDA8777HL/14/C1 TDA8777HL/24/C1 TDA8777HL/33/C1 t pipeline delay d(p) t input setup time su(i) t input hold time h(i) t output delay time d(o) CLK Digital inputs ( B0, SYNC, BLANK) Analog outputs ...
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Philips Semiconductors 12. Application information 0 THD (dB Sampling frequency = 140 MHz. Fig 5. THD as a function of f OUT 0 THD (dB Sampling frequency = ...
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Philips Semiconductors 0 SFDR (dB Sampling frequency = 240 MHz Fig 9. SFDR as a function ...
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Philips Semiconductors 13. Package outline LQFP48: plastic low profile quad flat package; 48 leads; body 1 pin 1 index DIMENSIONS (mm are the original ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Revision history Table 8: Revision history Document ID Release date TDA8777_3 20050815 • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. • Status ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...