M48T08Y STMICROELECTRONICS [STMicroelectronics], M48T08Y Datasheet - Page 19
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M48T08Y
Manufacturer Part Number
M48T08Y
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.M48T08Y.pdf
(30 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M48T08Y-10MH1
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
M48T08Y-10MH1E
Manufacturer:
SMSC
Quantity:
5 213
Maximum rating
Caution:
Caution:
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 6.
1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
2. For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget
3. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal
Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up
mode.
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
T
SLD
exceed 150°C for longer than 30 seconds).
not to exceed 180°C for between 90 to 150 seconds).
budget not to exceed 245°C for greater than 30 seconds).
Symbol
T
V
V
P
(1) (2) (3)
T
STG
I
CC
O
IO
A
D
Absolute maximum ratings
Ambient Operating Temperature
Storage Temperature (V
Lead Solder Temperature for 10 seconds
Input or Output Voltages
Supply Voltage
Output Current
Power Dissipation
Parameter
CC
Off, Oscillator Off)
–40 to 85
–0.3 to 7
–0.3 to 7
0 to 70
Value
260
20
1
Unit
mA
°C
°C
°C
W
V
V
19/30