PCA84C646P PHILIPS [NXP Semiconductors], PCA84C646P Datasheet - Page 68

• Manufacturer Part Number: PCA84C646P
• Description: Microcontrollers for TV tuning control and OSD applications
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
25 SOLDERING
25.1
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
25.2
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum (T
board has been pre-heated, forced cooling may be
necessary immediately after soldering to keep the
temperature within the permissible limit.
25.3
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
1995 Jun 15
Microcontrollers for TV tuning
control and OSD applications
Introduction
Soldering by dipping or by wave
Repairing soldered joints
stg max
). If the printed-circuit
68
PCA84C646; PCA84C846
Preliminary specification