PCF210AA NXP [NXP Semiconductors], PCF210AA Datasheet
PCF210AA
Related parts for PCF210AA
PCF210AA Summary of contents
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PCF2123 SPI Real time clock/calendar Rev. 5 — 27 April 2011 1. General description The PCF2123 is a CMOS applications. Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a maximum data rate of 6.25 Mbit/s. An alarm ...
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NXP Semiconductors 4. Ordering information Table 1. Ordering information Type number Package Name PCF2123BS/1 HVQFN16 PCF2123TS/1 TSSOP14 PCF2123U/5GA/1 wire bond die PCF2123U/10AA/1 wire bond die PCF2123U/12AA/1 WLCSP12 PCF2123U/12HA/1 WLCSP12 [1] Unsawn wafer. [2] Sawn 6 inch wafer on Film Frame ...
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NXP Semiconductors 6. Block diagram OSCI C OSCILLATOR OSCI 32.768 kHz OSCO C OSCO MONITOR TEST POWER ON RESET WATCH DOG SDO SDI SPI INTERFACE SCL Fig 1. Block diagram of PCF2123 PCF2123 ...
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NXP Semiconductors 7. Pinning information 7.1 Pinning terminal 1 index area OSCO 1 2 TEST PCF2123BS 3 INT CE 4 Transparent top view For mechanical details, see Fig 2. Pin configuration for HVQFN16 (PCF2123BS/1) Fig 4. PCF2123 Product data sheet ...
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NXP Semiconductors 7.2 Pin description Table 3. Pin description Symbol Pin HVQFN16 TSSOP14 (PCF2123BS/1) (PCF2123TS/1) OSCI 16 1 OSCO TEST 2 4 INT [ ...
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NXP Semiconductors 8. Functional description The PCF2123 contains 16 8-bit registers with an auto-incrementing address counter, an on-chip 32.768 kHz oscillator with two integrated load capacitors, a frequency divider which provides the source clock for the Real Time Clock (RTC), ...
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NXP Semiconductors I DD (nA) (1) I (2) Maximum value for R Fig 5. 8.1.2 Power consumptions with respect to timer mode Four source clocks are possible for the timer. The 4.096 kHz source clock will add the greatest part ...
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NXP Semiconductors 8.2 Register overview 16 registers are available. The time registers are encoded in the Binary Coded Decimal (BCD) format to simplify application use. Other registers are either bit-wise or standard binary. Table 4. Registers overview Bit positions labelled ...
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NXP Semiconductors 8.3 Control registers 8.3.1 Register Control_1 Table 5. Bit [1] Default value. [2] For a software reset, 01011000 (58h) must be sent to register Control_1 (see 8.3.1.1 Reset A reset ...
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NXP Semiconductors reset signal (1) When CE is inactive, the interface is reset. Fig 7. After reset, the following mode is entered: • 32.768 kHz on pin CLKOUT active • 24 hour mode is selected • Offset register is set ...
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NXP Semiconductors 8.3.2 Register Control_2 Table 7. Bit [1] Default value. PCF2123 Product data sheet Control_2 - control and status register 2 (address 01h) bits description Symbol Value Description [ ...
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NXP Semiconductors 8.4 Time and date function The majority of the registers are coded in the Binary Coded Decimal (BCD) format. BCD is used to simplify application use. An example is shown for the seconds in 8.4.1 Register Seconds Table ...
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NXP Semiconductors V DD oscillation OS flag Fig 9. The oscillator may be stopped, for example, by grounding one of the oscillator pins, OSCI or OSCO. The oscillator is also considered to be stopped during the time between power-on and ...
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NXP Semiconductors 8.4.4 Register Days Table 12. Bit [1] The PCF2123 compensates for leap years by adding a 29th day to February if the year counter contains a value which is ...
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NXP Semiconductors Table 16. Month January February March April May June July August September October November December 8.4.7 Register Years Table 17. Bit 8.4.8 Setting and reading the time Figure 10 Fig 10. Data ...
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NXP Semiconductors During read/write operations, the time counting circuits (memory locations 02h through 08h) are blocked. This prevents • Faulty reading of the clock and calendar during a carry condition • Incrementing the time registers during the read cycle After ...
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NXP Semiconductors 8.5 Alarm function When one or more of these registers are loaded with a valid minute, hour, day, or weekday and its corresponding alarm enable bit (AE_x) is logic 0, then that information will be compared with the ...
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NXP Semiconductors 8.5.4 Register Weekday_alarm Table 21. Bit [1] Default value. 8.5.5 Alarm flag By clearing the MSB, AE_x (Alarm Enable), of one or more of the alarm registers the corresponding alarm condition(s) ...
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NXP Semiconductors The generation of interrupts from the alarm function is controlled via bit AIE (register Control_2, see will remain set until cleared by the interface. Once AF has been cleared, it will only be set again when the time ...
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NXP Semiconductors 8.6 Timer functions The countdown timer has four selectable source clocks allowing for countdown periods in the range from 244 μ min. There are also two pre-defined timers which can be used to generate ...
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NXP Semiconductors INT when only MI enabled MSF when only MI enabled Fig 14. INT example for MI and SI Table 26. Minute interrupt (bit MI The minute and second flag (bit MSF) is set logic ...
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NXP Semiconductors 8.6.4 Countdown timer function The 8-bit countdown timer at address 0Fh is controlled by the register Timer_clkout at address 0Eh. The register Timer_clkout selects one of 4 source clock frequencies for the timer (4.096 kHz, 64 Hz, 1 ...
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NXP Semiconductors therefore changing it without setting bit may result in a corrupted value loaded into the countdown counter which results in an undetermined countdown period for the first period. The countdown value n will, however, be ...
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NXP Semiconductors Three examples are given for clearing the flags. Clearing the flags is made by a write command, therefore bits and 0 must be written with their previous values. Repeatedly re-writing these bits has no ...
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NXP Semiconductors 8.7 Interrupt output An active LOW interrupt signal is available at pin INT. Operation is controlled via the bits of register Control_2. Interrupts may be sourced from four places: second and minute timer, countdown timer, alarm function or ...
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NXP Semiconductors 8.7.1 Minute and second interrupts The pulse generator for the minute and second interrupt operates from an internal 64 Hz clock and consequently generates a pulse of If the MSF flag is cleared before the end of the ...
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NXP Semiconductors (1) Indicates normal duration of INT pulse (bit TI_TP = 1). Fig 18. Example of shortening the INT pulse by clearing the TF flag The timing shown for clearing bit TF in mode, i.e., when bit TI_TP = ...
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NXP Semiconductors 8.8 Clock output A programmable square wave is available at pin CLKOUT. Operation is controlled by the COF[2:0] bits in the register Timer_clkout. Frequencies of 32.768 kHz (default) down can be generated for use as ...
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NXP Semiconductors 8.9 Offset register The PCF2123 incorporates an offset register (address 0Dh) which can be used to implement several functions, such as: • Ageing adjustment • Temperature compensation • Accuracy tuning The offset is made once every two hours ...
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NXP Semiconductors Table 38. Correction value +1 or − − −3 : +59 or −59 +60 or −60 +61 or −61 +62 or −62 +63 or −63 −64 [1] Example is given in a time range ...
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NXP Semiconductors Table 39. Frequency (Hz) CLKOUT 32768 16384 8192 4096 2048 1024 1 Time source clock 4096 64 1 ⁄ PCF2123 Product data sheet Effect of correction pulses All information provided in this document is subject to ...
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NXP Semiconductors 8.10 External clock test mode A test mode is available which allows for on-board testing. In this mode it is possible to set up test conditions and control the operation of the RTC. The test mode is entered ...
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NXP Semiconductors 8.11 STOP bit function The function of the STOP bit is to allow for accurate starting of the time circuits. The STOP bit function will cause the upper part of the prescaler (F thus ticks ...
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NXP Semiconductors Table 40. First increment of time circuits after STOP bit release [1] Bit Prescaler bits STOP Clock is running normally 0 01-0 0001 1101 0100 STOP bit is activated ...
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NXP Semiconductors 9. 3-line serial interface Data transfer to and from the device is made via a 3-wire SPI-bus (see data lines for input and output are split. The data input and output lines can be connected together to facilitate ...
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NXP Semiconductors Table 42. Bit Figure 10 minutes. R SCL SDI CE address xx counter Fig 24. Serial bus write example R/W b7 ...
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NXP Semiconductors In Figure are not connected together. For this configuration important that pin SDI is never left floating. It must always be driven either HIGH or LOW. If pin SDI is left open, high I currents may ...
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NXP Semiconductors 10. Internal circuitry Fig 27. Device diode protection diagram of PCF2123 PCF2123 Product data sheet PCF2123 OSCI OSCO TEST INT All information provided in this document is subject to legal disclaimers. Rev. 5 — 27 ...
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NXP Semiconductors 11. Limiting values Table 43. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot V ESD stg T amb ...
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NXP Semiconductors 12. Static characteristics Table 44. Static characteristics specified. Symbol Parameter Supplies V supply voltage DD I supply current DD PCF2123 Product data sheet − ...
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NXP Semiconductors Table 44. Static characteristics specified. Symbol Parameter Inputs V LOW-level input voltage IL V HIGH-level input voltage IH V input voltage I I input ...
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NXP Semiconductors 13. Dynamic characteristics Table 45. SPI-bus characteristics − ° ° +85 SS amb referenced to V and V with an input voltage swing Symbol Parameter ...
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NXP Semiconductors CE t su(CE) SCL WRITE SDI R/W SA2 Hi Z SDO READ SDI SDO Fig 28. SPI-bus timing PCF2123 Product data sheet 80% 20% RA0 b6 b0 ...
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NXP Semiconductors 14. Application information Fig 29. Typical application diagram PCF2123 Product data sheet 1 F supercapacitor 100 OSCI OSCO A 1 farad super capacitor combined with a low V supply. With the RTC in its minimum ...
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NXP Semiconductors 15. Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS ...
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NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 ...
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NXP Semiconductors a. SOT758-1 (HVQFN16) of PCF2123BS/1 b. SOT402-1 (TSSOP14) of PCF2123TS/1 Fig 32. Three dimensional package drawings of PCF2123BS/1 and PCF2123TS/1 PCF2123 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 — ...
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NXP Semiconductors 16. Bare die outline Wire bond die; 12 bonding pads OUTLINE VERSION IEC PCF2123U/10 Fig 33. Bare die outline PCF2123U/10 of PCF2123U/5GA/1 and PCF2123U/10AA/1 (for dimensions see Table 46. Original ...
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NXP Semiconductors WLCSP12: wafer level chip size package; 12 bumps Outline version IEC PCF2123U/ Fig 34. Bare die outline PCF2123U/12 of PCF2123U/12AA/1 and PCF2123U/12HA/1 (for dimensions see PCF2123 Product data ...
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NXP Semiconductors Table 47. Original dimensions are in mm. Unit (mm) PCF2123U/12AA max nom min PCF2123U/12HA max nom min [1] Nominal die thickness. Compare with wafer thickness given in [2] Dimension includes saw lane. [3] P and P 1 [4] ...
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NXP Semiconductors Table 49. Coordinates x Location 693 Dimension 16 μm [1] The x/y coordinates of the alignment mark location represent the position of the REF point (see with respect to the center (x the chip; see ...
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NXP Semiconductors 17. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent ...
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NXP Semiconductors metal frame ∅ 193.50 mm 214.50 mm Fig 37. Film Frame Carrier (FFC) for 6 inch wafer (PCF2123U/10AA/1) plastic frame ∅ 250 mm 276 mm Fig 38. Film Frame Carrier (FFC) for 8 inch wafer (PCF2123U/12AA/1 and PCF2123U/12HA/1) ...
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NXP Semiconductors 19. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 19.1 Introduction to ...
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NXP Semiconductors 19.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including ...
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NXP Semiconductors Fig 39. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. PCF2123 Product data sheet maximum peak temperature = MSL limit, damage level temperature ...
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NXP Semiconductors 20. Footprint information for reflow soldering Footprint information for reflow soldering of HVQFN16 package (0.105 solder land solder paste deposit solder land plus solder paste occupied area Dimensions 0.500 ...
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NXP Semiconductors Footprint information for reflow soldering of TSSOP14 package solder land occupied area DIMENSIONS 0.650 0.750 7.200 4.500 1.350 Fig 41. Footprint information for reflow soldering of SOT402-1 (TSSOP14) package ...
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NXP Semiconductors 21. Abbreviations Table 53. Acronym CMOS BCD ESD FFC HBM LSB MM MOS MSB MSL PCB RTC SMD SPI PCF2123 Product data sheet Abbreviations Description Complementary Metal Oxide Semiconductor Binary Coded Decimal ElectroStatic Discharge Film Frame Carrier Human ...
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NXP Semiconductors 22. References [1] AN10365 — Surface mount reflow soldering description [2] AN10366 — HVQFN application information [3] AN10706 — Handling bare die [4] AN10853 — Handling precautions of ESD sensitive devices [5] IEC 60134 — Rating systems for ...
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NXP Semiconductors 24. Legal information 24.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use neither qualified nor tested in accordance with automotive testing ...
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NXP Semiconductors 26. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . ...