AD9518-0A-PCBZ AD [Analog Devices], AD9518-0A-PCBZ Datasheet - Page 44

• Manufacturer Part Number: AD9518-0A-PCBZ
• Description: 6-Output Clock Generator
• Manufacturer: AD [Analog Devices]

AD9518-0
THERMAL PERFORMANCE
Table 41. Thermal Parameters for the 48-Lead LFCSP
Symbol
θ
θ
θ
θ
Ψ
Ψ
Ψ
θ
Ψ
Ψ
Ψ
Use the following equation to determine the junction
temperature of the
where:
T
T
top center of the package.
Ψ
PD is the power dissipation of the device (see Table 16).
JA
JMA
JMA
JB
JC
J
CASE
JB
JB
JB
JT
JT
JT
JT
is the junction temperature (°C).
is the value from Table 41.
T
is the case temperature (°C) measured by the user at the
J
= T
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board thermal resistance, natural convection per JEDEC JESD51-8 (still air)
Junction-to-board characterization parameter, natural convection per JEDEC JESD51-6 (still air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-board characterization parameter, 2.5 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
Junction-to-top-of-package characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-top-of-package characterization parameter, 2.0 m/sec airflow per JEDEC JESD51-2 (still air)
+ (Ψ
AD9518
JT
× PD)
on the application PCB:
Rev. C | Page 44 of 64
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the following equation:
JA
can be used for a first-order
Data Sheet
Value (°C/W)
24.7
21.6
19.4
12.9
11.9
11.8
11.6
1.3
0.5
0.2
0.3