TDA8357 Philips Semiconductors, TDA8357 Datasheet - Page 14

• Manufacturer Part Number: TDA8357
• Description: Full bridge vertical deflection output circuit in LVDMOS
• Manufacturer: Philips Semiconductors

Philips Semiconductors
PACKAGE OUTLINE
1999 Nov 10
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
Full bridge vertical deflection output circuit
in LVDMOS
DIMENSIONS (mm are the original dimensions)
UNIT
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D 1 may protrude 0.04 mm maximum.
mm
OUTLINE
VERSION
SOT523-1
A 2
2.7
2.3
(2)
0.80
0.65
b p
0.58
0.48
k
c
13.2
12.8
D
1
Z
(1)
D 1
6.2
5.8
IEC
(2)
D h
3.5
e
D 1
D
P
14.7
14.3
E
(1)
e 1
E h
3.5
JEDEC
2.54
b p
e
9
1.27
REFERENCES
e 1
0
q 2
5.08
w
e 2
M
E
3.0
2.0
k
non-concave
scale
EIAJ
12.4
11.0
14
L
5
11.4
10.0
L 1
x
6.7
5.5
L 2
10 mm
L
L 2
4.5
3.7
L 3
view B: mounting base side
B
L 3
Q
2.8
m
3.4
3.1
A 2
P
m
D h
1.15
0.85
Q
PROJECTION
EUROPEAN
17.5
16.3
e 2
q
E h
c
4.85
q 1
Preliminary specification
3.8
3.6
q 2
q
q 1
L 1
0.8
TDA8357J
v
v
M
ISSUE DATE
0.3
98-11-12
w
0.02
SOT523-1
x
1.65
1.10
Z
(1)