TDA8357 Philips Semiconductors, TDA8357 Datasheet - Page 11

• Manufacturer Part Number: TDA8357
• Description: Full bridge vertical deflection output circuit in LVDMOS
• Manufacturer: Philips Semiconductors

Philips Semiconductors
Heatsink calculation
The value of the heatsink can be calculated in a standard
way with a method based on average temperatures.
The required thermal resistance of the heatsink is
determined by the maximum die temperature of 150 C.
In general we recommend to design for an average die
temperature not exceeding 130 C.
E
Measured or given values: P
T
1999 Nov 10
j
XAMPLE
= 110 C; R
Full bridge vertical deflection output circuit
in LVDMOS
th(j-c)
= 5 K/W; R
tot
th(c-h)
= 3 W; T
= 2 K/W.
amb
= 40 C;
11
The required heatsink thermal resistance is given by:
When we use the values given we find:
The heatsink temperature will be:
T
R
R
h
th h a
th h a
= T
–
–
amb
=
=
+ (R
T
----------------------- -
110 40
--------------------- -
j
th(h-a)
–
P
3.0
T
tot
–
amb
–
–
P
tot
5
R
) = 40 + (3
+
th j c
2
–
=
+
Preliminary specification
16 K/W
R
th c h
16) = 90 C
TDA8357J
–