M29DW323DB ST Microelectronics, M29DW323DB Datasheet - Page 32

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M29DW323DB

Manufacturer Part Number
M29DW323DB
Description
32 Mbit 4Mb x8 or 2Mb x16 / Dual Bank 8:24 / Boot Block 3V Supply Flash Memory
Manufacturer
ST Microelectronics
Datasheet

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M29DW323DT, M29DW323DB
PART NUMBERING
Table 20. Ordering Information Scheme
M29DW323DB
Example:
70
N
1
T
Device Type
M29
Architecture
D = Dual Bank
Operating Voltage
W = V
= 2.7 to 3.6V
CC
Device Function
323D = 32 Mbit (x8/x16), Boot Block, 1/4-3/4 partitioning
Array Matrix
T = Top Boot
B = Bottom Boot
Speed
70 = 70 ns
90 = 90 ns
Package
N = TSOP48: 12 x 20 mm
ZA = TFBGA63: 7 x 11mm, 0.80 mm pitch
ZE = TFBGA48: 6 x 8mm, 0.8mm pitch
Temperature Range
1 = 0 to 70 °C
6 = –40 to 85 °C
Option
Blank = Standard Packing
T = Tape & Reel Packing
E = Lead-free Package, Standard Packing
F = Lead-free Package, Tape & Reel Packing
Note: This product is also available with the Extended Block factory locked. For further details and ordering
information contact your nearest ST sales office.
Devices are shipped from the factory with the memory content bits erased to ’1’.
For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de-
vice, please contact the ST Sales Office nearest to you.
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