SC16C2550B_07 PHILIPS [NXP Semiconductors], SC16C2550B_07 Datasheet - Page 34
SC16C2550B_07
Manufacturer Part Number
SC16C2550B_07
Description
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Manufacturer
PHILIPS [NXP Semiconductors]
Datasheet
1.SC16C2550B_07.pdf
(43 pages)
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NXP Semiconductors
Fig 19. Package outline SOT617-1 (HVQFN32)
SC16C2550B_4
Product data sheet
HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT617-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
0.30
0.18
8
1
b
- - -
IEC
9
0.2
32
c
e
D
5.1
4.9
(1)
3.25
2.95
D h
D h
e 1
D
MO-220
JEDEC
1/2
0
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
E
5.1
4.9
e
(1)
REFERENCES
Rev. 04 — 15 February 2007
b
3.25
2.95
E h
25
16
0.5
e
17
24
JEITA
scale
- - -
B
2.5
1/2
e
3.5
e
e 1
w
A
E
v
e 2
M
M
C
C
3.5
e 2
A
B
0.5
0.3
L
5 mm
0.1
A
v
A 1
y 1 C
0.05
w
PROJECTION
EUROPEAN
0.05
detail X
y
SC16C2550B
0.1
y 1
X
C
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
01-08-08
02-10-18
SOT617-1
c
34 of 43
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