LTC2207 LINER [Linear Technology], LTC2207 Datasheet - Page 26

• Manufacturer Part Number: LTC2207
• Description: 16-Bit, 105Msps/80Msps ADCs
• Manufacturer: LINER [Linear Technology]

LTC2207/LTC2206
APPLICATIONS INFORMATION
Grounding and Bypassing
The LTC2207/LTC2206 require a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2207/LTC2206 has been optimized for a fl owthrough
layout so that the interaction between inputs and digital
outputs is minimized. Layout for the printed circuit board
should ensure that digital and analog signal lines are
separated as much as possible. In particular, care should
be taken not to run any digital track alongside an analog
signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the V
be located as close to the pins as possible. The traces
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DD,
V
CM
, and OV
DD
pins. Bypass capacitors must
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2207/LTC2206 differential inputs should run
parallel and close to each other. The input traces should
be as short as possible to minimize capacitance and to
minimize noise pickup.
Heat Transfer
Most of the heat generated by the LTC2207/LTC2206 is
transferred from the die through the bottom-side exposed
pad. For good electrical and thermal performance, the
exposed pad must be soldered to a large grounded pad
on the PC board. It is critical that the exposed pad and all
ground pins are connected to a ground plane of suffi cient
area with as many vias as possible.
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