ASM3I1819NF-08-SR PULSECORE [PulseCore Semiconductor], ASM3I1819NF-08-SR Datasheet - Page 2

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ASM3I1819NF-08-SR

Manufacturer Part Number
ASM3I1819NF-08-SR
Description
Low Power Mobile VGA EMI Reduction IC
Manufacturer
PULSECORE [PulseCore Semiconductor]
Datasheet
February 2007
rev 0.3
Pin Configuration
Pin Description
Absolute Maximum Ratings
Output Frequency and Modulation Rate
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
Input Frequency Range
Symbol
VDD, V
T
T
device reliability.
T
T
T
Pin#
STG
DV
A
s
J
1
2
3
4
5
6
7
8
IN
20 to 40
(MHz)
Voltage on any pin with respect to Ground
Storage temperature
Operating temperature
Max. Soldering Temperature (10 sec)
Junction Temperature
Static Discharge Voltage
(As per JEDEC STD22- A114-B)
Pin Name
ModOUT
XOUT
VDD
VSS
REF
PD#
XIN
NC
Notice: The information in this document is subject to change without notice.
Output Frequency Range
Type
O
O
P
P
I
-
I
I
Low Power Mobile VGA EMI Reduction IC
ModOUT
20 to 40
(MHz)
VSS
XIN
Parameter
NC
Connect to externally generated Clock signal or Crystal.
Ground Connection. Connect to system ground.
No Connect.
Spread spectrum clock output.
Non-modulated Reference clock output of the input frequency.
Power down control pin. Pull LOW to enable Power-Down mode. This pin
has an internal pull-up resistor.
Connect to +3.3V.
Connect to crystal. No connect if externally generated clock signal is used.
3
1
2
4
ASM3P1819N
Input Frequency / 512
Modulation Rate
7
5
8
6
XOUT
VDD
PD#
REF
Description
-0.5 to +4.6
-65 to +125
-40 to +85
Rating
ASM3P1819N
Spread Deviation
260
150
2
-1.25
(%)
2 of 7
Unit
KV
°C
°C
°C
°C
V

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