C1206H124C1GACTU KEMET [Kemet Corporation], C1206H124C1GACTU Datasheet - Page 6

• Manufacturer Part Number: C1206H124C1GACTU
• Manufacturer: KEMET [Kemet Corporation]

Soldering Process
All parts incorporate the standard KEMET barrier layer of pure nickel, with an overplate of pure tin to provide excellent solderability as
well as resistance to leaching.
HMP solders ,e.g., Pb94, are recommended for high temperature applications.
Marking
These chips will be supplied unmarked. If required, they can be laser-marked as an extra option. Details on the marking format are
included in KEMET Surface Mount catalog F3102.
In general, the information in the KEMET Surface Mount catalog F3102 applies to these capacitors. The information in this bulletin
supplements that in the catalog.