X00602MA STMICROELECTRONICS [STMicroelectronics], X00602MA Datasheet - Page 3
X00602MA
Manufacturer Part Number
X00602MA
Description
0.8A SCRs
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.X00602MA.pdf
(5 pages)
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Fig. 1: Maximum average power dissipation
versus average on-state current.
Fig. 2-2: Average and D.C. on-state current
versus ambient temperature (device mounted on
FR4 with recommended pad layout).
Fig. 4: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature.
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
0
0.0
IGT, IH, IL[Tj] / IGT, IH, IL[Tj = 25 °C]
IT(av)(A)
P(W)
= 180°
-20
= 180°
0.1
25
0
D.C.
20
0.2
50
Tamb(°C)
IT(av)(A)
40
Tj(°C)
0.3
60
75
IGT
0.4
80
100
100
0.5
360°
IH & IL
120
125
0.6
140
Fig. 2-1: Average and D.C. on-state current
versus lead temperature.
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration.
Fig. 5: Relative variation of holding current
versus gate-cathode resistance (typical values).
1.00
0.10
0.01
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1E-2
1E-2
IH[Rgk]/IH[Rgk=1k ]
0
IT(av)(A)
K = [Zth(j-a)/Rth(j-a)]
D.C.
1E-1
25
1E-1
= 180°
50
1E+0
Rgk(k )
Tlead(°C)
1E+0
tp(s)
75
1E+1
1E+1
X00602MA
100
1E+2
5E+2
1E+2
125
3/5