FS6051 American Microsystems, Inc., FS6051 Datasheet - Page 16

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FS6051

Manufacturer Part Number
FS6051
Description
Low-skew Clock Fanout Buffer ic
Manufacturer
American Microsystems, Inc.
Datasheet
ISO9001
ISO9001
ISO9001
ISO9001
FS6050/FS6051/FS6053/FS6054
FS6050/FS6051/FS6053/FS6054
FS6050/FS6051/FS6053/FS6054
FS6050/FS6051/FS6053/FS6054
Low-Skew Clock Fanout Buffer ICs
Low-Skew Clock Fanout Buffer ICs
Low-Skew Clock Fanout Buffer ICs
Low-Skew Clock Fanout Buffer ICs
Table 16: 28-pin SSOP (5.3mm/0.209") Package Dimensions
Table 17: 28-pin SSOP (5.3mm/0.209") Package Characteristics
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
A
A
C
D
H
A
B
E
e
L
1
2
0.068
0.002
0.066
0.005
0.396
0.205
0.301
0.022
MIN.
0.01
0
0.028 BSC
INCHES
PARAMETER
MAX.
0.078
0.008
0.015
0.008
0.407
0.212
0.311
0.037
0.07
DIMENSIONS
8
10.07
MILLIMETERS
MIN.
1.73
0.05
1.68
0.25
0.13
5.20
7.65
0.55
0
0.65 BSC
MAX.
10.33
2.00
0.21
1.78
0.38
0.20
5.38
7.90
0.95
8
SYMBOL
C
C
L
L
11
12
JA
11
12
BASE PLANE
28
1
AMERICAN MICROSYSTEMS, INC.
B
Air flow = 0 m/s
Center lead
Center lead to any adjacent lead
Center lead to V
Center lead to any adjacent lead
16
D
CONDITIONS/DESCRIPTION
e
SEATING PLANE
SS
A
1
E
A
ALL RADII:
0.005" TO 0.01"
2
H
A
C
L
TYP.
2.24
0.95
0.25
0.07
97
7° typ.
UNITS
°C/W
nH
nH
pF
pF
3.4.02

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