NTD3055L170-1 ONSEMI [ON Semiconductor], NTD3055L170-1 Datasheet
NTD3055L170-1
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NTD3055L170-1 Summary of contents
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... MARKING DIAGRAMS 4 Drain 4 DPAK CASE 369AA (Surface Mounted) STYLE Drain Gate Source 4 Drain 4 DPAK−3 CASE 369D (Straight Lead) STYLE Gate Drain Source 3170L = Device Code A = Assembly Location Y = Year W = Work Week ORDERING INFORMATION Publication Order Number: NTD3055L170/D ...
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... Switching characteristics are independent of operating junction temperatures. ORDERING INFORMATION Device NTD3055L170 NTD3055L170G NTD3055L170−1 NTD3055L170−1G NTD3055L170T4 NTD3055L170T4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. NTD3055L170 ( unless otherwise noted Vdc ...
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... Gate−to−Source Voltage 2 4 1.8 1.6 1.4 1.2 1 0.8 0.6 −50 − 100 T , JUNCTION TEMPERATURE ( C) J Figure 5. On−Resistance Variation with Temperature NTD3055L170 3 100 1 GATE−TO−SOURCE VOLTAGE (VOLTS) GS Figure 2 ...
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... GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) NTD3055L170 POWER MOSFET SWITCHING The capacitance (C a voltage corresponding to the off−state condition when calculating t on−state when calculating t At high switching speeds, parasitic circuit elements complicate the analysis. The inductance of the MOSFET ...
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... T )/(R ). qJC J(MAX Power MOSFET designated E−FET can be safely used in switching circuits with unclamped inductive loads. For NTD3055L170 1000 100 Figure 9 ...
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... DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.2 0.1 1 0.05 0.01 SINGLE PULSE 001 0.00001 0.0001 I Figure 14. Diode Reverse Recovery Waveform NTD3055L170 SAFE OPERATING AREA 100 STARTING JUNCTION TEMPERATURE ( C) J Figure 12. Maximum Avalanche Energy versus ...
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... 0.13 (0.005) M 5.80 0.228 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NTD3055L170 PACKAGE DIMENSIONS DPAK CASE 369C−01 ISSUE O SEATING −T− PLANE SOLDERING FOOTPRINT* 6 ...
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... K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−− STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NTD3055L170/D ...