A1240A-1CQ176B ACTEL [Actel Corporation], A1240A-1CQ176B Datasheet - Page 5

• Manufacturer Part Number: A1240A-1CQ176B
• Description: ACT2 Family FPGAs
• Manufacturer: ACTEL [Actel Corporation]

A C T
Pa c ka ge T he r m a l C ha r a ct e r i s t i c s
The device junction to case thermal characteristic is θ jc,
and the junction to ambient air characteristic is θ ja. The
thermal characteristics for θ ja are shown with two different
air flow rates.
Po w e r D i ss i pa t i o n
P = [I
I
Where:
I
are changing.
I
I
V
N equals the number of outputs driving TTL loads to V
M equals the number of outputs driving TTL loads to V
An accurate determination of N and M is problematical
because their values depend on the family type, design
details, and on the system I/O. The power can be divided
into two components: static and active.
S tat i c P ow er Co m ponen t
Actel FPGAs have small static power components that
result in lower power dissipation than PALs or PLDs. By
integrating multiple PALs/PLDs into one FPGA, an even
Package Type
Ceramic Pin Grid Array
Ceramic Quad Flat Pack
Plastic Quad Flat Pack
Plastic Leaded Chip Carrier
Very Thin Quad Flat Pack
Thin Quad Flat Pack
Notes:(Maximum Power in Still Air)
1.
2.
3.
4.
OH
CC
CC
OL
OL
, I
standby is the current flowing when no inputs or outputs
, V
active is the current flowing due to CMOS switching.
* (V
™
Maximum Power Dissipation for PQFP packages are 1.9 Watts (100-pin), 2.3 Watts (144-pin), and 2.4 Watts (160-pin).
Maximum Power Dissipation for PLCC packages is 2.7 Watts.
Maximum Power Dissipation for VQFP packages is 2.3 Watts.
Maximum Power Dissipation for TQFP packages is 3.1 Watts.
OH
CC
OH
2 F a m il y F PG A s
CC
standby + I
are TTL sink/source currents.
are TTL level output voltages.
– V
OH
) * M
CC
4
active] * V
1
Max. junction temp. (°C) – Max. commercial temp.
---------------------------------------------------------------------------------------------------------------------------- -
3
2
CC
+ I
OL
Pin Count
* V
100
132
176
172
100
144
160
100
176
θja (°C/W)
OL
84
* N +
OL
OH
.
.
v4.0
θjc
13
15
15
12
12
15
5
5
8
8
Maximum junction temperature is 150°C.
A sample calculation of the absolute maximum power
dissipation allowed for a PQFP 160-pin package at
commercial temperature is as follows:
greater reduction in board-level power dissipation can be
achieved.
The power due to standby current is typically a small
component of the overall power. Standby power is
calculated below for commercial, worst case conditions.
I
2 mA
The static power dissipated by TTL loads depends on the
number of outputs driving high or low and the DC load
current. Again, this value is typically small. For instance, a
32-bit bus sinking 4 mA at 0.33 V will generate 42 mW with
all outputs driving low, and 140 mW with all outputs driving
high. The actual dissipation will average somewhere
between as I/Os switch states with time.
Ac ti ve P ower Com po nent
Power dissipation in CMOS devices is usually dominated by
the active (dynamic) power dissipation. This component is
frequency dependent, a function of the logic and the
external I/O. Active power dissipation results from charging
internal
unprogrammed antifuses, module inputs, and module
outputs, plus external capacitance due to PC board traces
CC
=
chip
150°C – 70°C
---------------------------------
Still Air
V
5.25V
33°C/W
CC
θja
35
30
23
25
48
40
38
37
43
32
capacitances
Power
10.5 mW
=
2.4 W
300 ft/min
θja
17
15
12
15
40
32
30
28
35
25
of
the
interconnect,
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
5