ssd1322z Newhaven Display International, Inc, ssd1322z Datasheet - Page 6

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ssd1322z

Manufacturer Part Number
ssd1322z
Description
480 X 128, Dot Matrix High Power Oled/pled Segment/common Driver With Controller
Manufacturer
Newhaven Display International, Inc
Datasheet
1
SSD1322 is a single-chip CMOS OLED/PLED driver with controller for organic/polymer light emitting diode
dot-matrix graphic display system. It consists of 480 segments and 128 commons. This IC is designed for
Common Cathode type OLED/PLED panel.
SSD1322 displays data directly from its internal 480 x 128 x 4 bits Graphic Display Data RAM (GDDRAM).
Data/Commands are sent from general MCU through the hardware selectable 6800-/8080-series compatible
Parallel Interface or Serial Peripheral Interface. This driver IC has a 256 steps contrast control and can be
widely used in many applications such as automotive and industrial control panel.
2
3
SSD1322
SSD1322Z
SSD1322UR1
Part Number
Ordering
GENERAL DESCRIPTION
FEATURES
ORDERING INFORMATION
Resolution: 480 x 128 dot matrix panel
Power supply
When V
For matrix display
16 gray scale levels supported by embedded 480 x 128 x 4 bit SRAM display buffer
Selectable MCU Interfaces:
Selectable Common current sinking mode:
8-bit programmable Gray Scale Look Up Table
High Power Protection
Programmable Frame Rate and Multiplexing Ratio
Row re-mapping and Column re-mapping
Sleep mode current <10uA with ram data kept
Operating temperature range -40°C to 85°C.
o 8-bit 6800/8080-series parallel interface
o V
o V
o V
o V
o OLED driving output voltage, 20V maximum
o Segment maximum source current: 300uA
o Common maximum sink current: 80mA
o 256 step contrast brightness current control, 16 step master current control
o 3/4-wire Serial Peripheral Interface
o Dual COM mode
o Single COM mode
Rev 0.10
SEG
480
256
CI
DD
DDIO
CI
CC
is lower than 2.6V, V
= 10.0V – 20.0V
= 2.4V - 3.5V
= 2.4V – 2.6V
= 1.65V – V
COM
COM)
(dual
128
P 6/56
64
bump Die
Package
Apr 2008
Form
Gold
COF
CI
Table 3-1 : Ordering Information
DD
Page 12, 55
Reference
should be supplied by external power source
Page 8
• Min SEG pitch: 25um
• Min COM pitch: 35um
• Die thickness: 300 +/- 25um
• 70mm film, 4 SPH
• 8-bit 80/68/SPI interfaces
• SEG, COM lead pitch 0.12mm x 0.999 = 0.11988mm
• Also support 128 MUX (single COM)
(Core V
(MCU interface logic level)
(Low voltage power supply)
(Panel driving power supply)
Die thickness: 457 +/- 25um
DD
power supply, can be regulated from V
Remark
Solomon Systech
CI
)

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