apa4838 Anpec Electronics Corporation, apa4838 Datasheet - Page 25

• Manufacturer Part Number: apa4838
• Description: Stereo 2.8w Audio Power Amplifier With Dc Volume Control And Selectable Gain
• Manufacturer: Anpec Electronics Corporation

APA4838
Application Descriptions (Cont.)
Thermal Pad Considerations
The thermal pad must be connected to ground. The
package with thermal pad of the APA4838 requires
special attention on thermal design. If the thermal
design issues are not properly addressed, the
APA4838 4 will go into thermal shutdown when driv-
ing a 4 load.
The thermal pad on the bottom of the APA4838 should
be soldered down to a copper pad on the circuit board.
Heat can be conducted away from the thermal pad
through the copper plane to ambient. If the copper
plane is not on the top surface of the circuit board, 8
to 10 vias of 13 mil or smaller in diameter should be
used to thermally couple the thermal pad to the bot-
tom plane. For good thermal conduction, the vias must
be plated through and solder filled. The copper plane
used to conduct heat away from the thermal pad
should be as large as practical.
If the ambient temperature is higher than 25°C, a
larger copper plane or forced-air cooling will be re-
quired to keep the APA4838 junction temperature
below the thermal shutdown temperature (150°C).
In higher ambient temperature, higher airflow rate and/
or larger copper area will be required to keep the IC
out of thermal shutdown.
Copyright
ANPEC Electronics Corp.
25
www.anpec.com.tw
Rev. A.1 - Apr., 2003