en29lv010-45rtip Eon Silicon Solution Inc., en29lv010-45rtip Datasheet - Page 7

• Manufacturer Part Number: en29lv010-45rtip
• Description: Da0. 1 Megabit 128k X 8-bit Uniform Sector Cmos 3.0 Volt-only Flash Memory
• Manufacturer: Eon Silicon Solution Inc.

EN29LV010
whichever happens later. All data is latched on the rising edge of WE# or CE#, whichever happens
first. The system is not required to provide further controls or timings. The device automatically
provides internally generated program / erase pulses and verifies the programmed /erased cells’
margin. The host system can detect completion of a program or erase operation by reading the
DQ[7] (Data# Polling) and DQ[6] (Toggle) status bits.
The ‘Command Definitions’ section of this document provides details on the specific device
commands implemented in the EN29LV010.
Sector Protection/Unprotection
The hardware sector protection feature disables both program and erase operations in any sector. The
hardware sector unprotection feature re-enables both program and erase operations in previously
protected sectors.
Sector protection/unprotection is intended only for programming equipment. This method requires
V
be applied to both OE# and A9 pin and non-standard microprocessor timings are used. This
ID
method is described in a separate document called EN29LV010 Supplement,
which can be obtained
by contacting a representative of Eon Silicon Solution, Inc.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy consumption. The device automatically
enables this mode when addresses remain stable for t
+ 30ns. The automatic sleep mode is
acc
independent of the CE#, WE# and OE# control signals. Standard address access timings provide
new data when addresses are changed. While in sleep mode, output is latched and always available
to the system. ICC
in the DC Characteristics table represents the automatic sleep more current
4
specification.
This Data Sheet may be revised by subsequent versions
©2003 Eon Silicon Solution, Inc., www.essi.com.tw
7
or modifications due to changes in technical specifications.
Rev. C, Issue Date: 2008/04/23