HEF4082BT,653 NXP Semiconductors, HEF4082BT,653 Datasheet
HEF4082BT,653
Specifications of HEF4082BT,653
HEF4082BTD-T
HEF4082BTD-T
Related parts for HEF4082BT,653
HEF4082BT,653 Summary of contents
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HEF4082B Dual 4-input AND gate Rev. 4 — 23 August 2011 1. General description The HEF4082B is a dual 4-input AND gate. The outputs are fully buffered for highest noise immunity and pattern insensitivity to output impedance variations. It operates ...
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... NXP Semiconductors 4. Functional diagram aaa-000168 Fig 1. Functional diagram 5. Pinning information 5.1 Pinning Fig 3. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin 1A, 1B, 1C 2A, 2B, 2C 10, 11 HEF4082B Product data sheet Fig HEF4082B n. aaa-000170 Description input input output not connected ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Input [ HIGH voltage level LOW voltage level don’t care. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to V Symbol Parameter V supply voltage DD I input clamping current ...
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... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics unless otherwise specified Symbol Parameter Conditions I < 1 A V HIGH-level IH O input voltage I < 1 A V LOW-level IL O input voltage I < 1 A V HIGH-level OH O output voltage I < 1 A ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics pF amb Symbol Parameter t propagation delay pd t HIGH to LOW output THL transition time t LOW to HIGH output TLH transition time [1] The typical value of the propagation delay and output transition time can be calculated with the extrapolation formula (C ...
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... NXP Semiconductors Table 9. Measurement points Supply voltage Test data is given in Table Definitions for test circuit: DUT = Device Under Test load capacitance including jig and probe capacitance termination resistance should be equal to the output impedance Z T Fig 5. Test circuit Table 10. Test data Supply voltage ...
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... NXP Semiconductors 12. Package outline DIP14: plastic dual in-line package; 14 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. Temperature range maximum increased from 85 C to 125 C throughout the data sheet. ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 16. Contact information For more information, please visit: For sales office addresses, please send an email to: HEF4082B Product data sheet 15 ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Abbreviations ...