SMP30 STMICROELECTRONICS [STMicroelectronics], SMP30 Datasheet - Page 5

• Manufacturer Part Number: SMP30
• Description: TELECOM EQUIPMENT PROTECTION: TRISIL
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Fig. 3: Relative variation of holding current versus
junction temperature.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Fig. 5: Relative variation of leakage current versus
junction temperature (typical values).
Fig. 7: Relative variation of junction capacitance
versus reverse voltage applied (typical values).
2000
1000
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
10
1
C[V ] / C[V =50V]
I [T ] / I [T =25°C]
1
H
25
I
RM
R
j
V =V
-20
[T ] / I
R
2
j
H
RM
j
RM
R
0
[T =25°C]
50
5
j
20
10
V (V)
T (°C)
T (°C)
R
40
j
j
75
20
60
50
100
80
100
100
VRMS=1V
F=1MHz
Tj=25°C
120
125
300
Fig. 4: Relative variation of breakover voltage ver-
sus junction temperature.
1.10
1.05
1.00
0.95
0.90
Fig. 6: Relative variation of thermal impedance
versus pulse duration.
1E+2
1E+1
1E+0
1E-1
-40
1E-3
V
62 V
270 V
Z
BO
th(j-a)
[T ] / V
j
-20
(°C/W)
1E-2
BO
[T =25°C]
0
j
1E-1
20
T (°C)
t (s)
p
j
Zth(j-a)
1E+0
40
1E+1
60
SMP30-xxx
1E+2
80
5E+2
100
5/8