74HCT1G02GW,165 NXP Semiconductors, 74HCT1G02GW,165 Datasheet
74HCT1G02GW,165
Specifications of 74HCT1G02GW,165
74HCT1G02GW-R
935245620165
Related parts for 74HCT1G02GW,165
74HCT1G02GW,165 Summary of contents
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NOR gate Rev. 04 — 11 July 2007 1. General description 74HC1G02 and 74HCT1G02 are high speed Si-gate CMOS devices. They provide a 2-input NOR function. The HC device has CMOS input switching levels and supply voltage ...
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... NXP Semiconductors 5. Functional diagram mna103 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning Fig 4. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin GND Functional description Table 4. Function table H = HIGH voltage level LOW voltage level Inputs 74HC_HCT1G02_4 Product data sheet 74HC1G02 ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK I output clamping current OK I output current O I supply current CC I ground current ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). All typical values are measured at T Symbol Parameter V HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I supply current CC C input capacitance I For type 74HCT1G02 V HIGH-level input IH voltage V LOW-level input ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics GND = 6.0 ns; All typical values are measured Symbol Parameter Conditions For type 74HC1G02 t propagation delay A and see power dissipation V = GND capacitance For type 74HCT1G02 t propagation delay A and see power dissipation V = GND capacitance [ the same as t and t ...
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... NXP Semiconductors 13. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 7 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions UNIT 0.100 0.40 1.1 0.26 mm 0.013 0.25 0.9 0.10 OUTLINE VERSION IEC SOT753 Fig 8. Package outline SOT753 (SC-74A) 74HC_HCT1G02_4 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... Release date 74HC_HCT1G02_4 20070711 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Package SOT353 changed to SOT353-1 in • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Functional description . . . . . . . . . . . . . . . . . . . 2 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 14 Abbreviations ...