SI3200-X-FS SILABS [Silicon Laboratories], SI3200-X-FS Datasheet - Page 106

• Manufacturer Part Number: SI3200-X-FS
• Manufacturer: SILABS [Silicon Laboratories]

Si3220/25
6. Package Outline: 64-Pin TQFP
Figure 65 illustrates the package details for the Dual ProSLIC. Table 52 lists the values for the dimensions shown
in the illustration.
106
Notes:
Symbol
D1, E1
D2, E2
D, E
1. All dimensions are shown in millimeters unless otherwise noted.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. This package outline conforms to JEDEC MS-026, variant ACD-HD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020B specification for Small Body
A1
A2
A
b
c
Components.
0.05
0.95
0.17
0.09
5.85
Min
—
Figure 65. 64-Pin Thin Quad Flat Package (TQFP)
Millimeters
12.00 BSC
10.00 BSC
Nom
1.00
0.22
6.00
—
—
—
Table 52. Package Dimensions
Max
1.20
0.15
1.05
0.27
0.20
6.15
Rev. 1.2
Symbol
aaa
bbb
ddd
ccc
Θ
e
L
0.45
Min
—
—
—
—
0°
Millimeters
0.50 BSC
Nom
0.60
3.5°
—
—
—
—
0.20
Max
0.75
0.20
0.08
0.08
7°