Z0109MN/T3 NXP [NXP Semiconductors], Z0109MN/T3 Datasheet - Page 6

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Z0109MN/T3

Manufacturer Part Number
Z0109MN/T3
Description
Logic level four-quadrant triac
Manufacturer
NXP [NXP Semiconductors]
Datasheet
NXP Semiconductors
5. Thermal characteristics
Table 5.
Z0109MN
Product data sheet
Symbol
R
R
Fig 6.
th(j-sp)
th(j-a)
All dimensions are in mm
Minimum footprint SOT223
Thermal characteristics
min
min
1.5
1.5
Parameter
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
(3×)
min
1.5
3.8 min
4.6
2.3
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All information provided in this document is subject to legal disclaimers.
Conditions
full cycle; see
full cycle; printed circuit board
mounted; minimum footprint;
see
full cycle; printed circuit board
mounted; pad area; see
6.3
Figure 6
Rev. 05 — 22 March 2011
Figure 8
Fig 7.
Figure 7
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Printed circuit board pad area: SOT223
60
10
9
4.6
Min
-
-
-
36
15
50
7
Typ
-
156
70
Z0109MN
© NXP B.V. 2011. All rights reserved.
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Max
15
-
-
4.5
18
4Q Triac
Unit
K/W
K/W
K/W
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