BAP1321-03_01 NXP [NXP Semiconductors], BAP1321-03_01 Datasheet - Page 2

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BAP1321-03_01

Manufacturer Part Number
BAP1321-03_01
Description
Silicon PIN diode
Manufacturer
NXP [NXP Semiconductors]
Datasheet
Philips Semiconductors
FEATURES
APPLICATIONS
DESCRIPTION
Planar PIN diode in a SOD323 ultra small SMD plastic
package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2001 May 11
V
I
P
T
T
F
stg
j
High voltage, current controlled
RF resistor for RF attenuators and switches
Low diode capacitance
Low diode forward resistance
Very low series inductance
For applications up to 3 GHz.
RF attenuators and switches.
R
tot
Silicon PIN diode
SYMBOL
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
2
90 C
PINNING
handbook, halfpage
Marking code: V8.
Fig.1 Simplified outline (SOD323) and symbol.
CONDITIONS
1
PIN
1
2
cathode
anode
MIN.
2
65
65
Product specification
DESCRIPTION
BAP1321-03
MAM406
60
100
500
+150
+150
MAX.
V
mA
mW
UNIT
C
C

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