BAW56M NXP [NXP Semiconductors], BAW56M Datasheet
BAW56M
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BAW56M Summary of contents
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... High-speed switching diodes Rev. 05 — 26 November 2007 1. Product profile 1.1 General description High-speed switching diodes, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table 1. Type number Package BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W 1.2 Features I High switching speed Low leakage current I Small SMD plastic packages 1 ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin BAV756S BAW56; BAW56T; BAW56W BAW56M BAW56S BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series Pinning Description anode (diode 1) cathode (diode 2) common anode (diode 2 and diode 3) cathode (diode 3) anode (diode 4) ...
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... SC-75 plastic surface-mounted package; 3 leads SC-70 plastic surface-mounted package; 3 leads Marking codes Limiting values Parameter Conditions repetitive peak reverse voltage reverse voltage forward current BAV756S T BAW56 T BAW56M T BAW56S T BAW56T T BAW56W T Rev. 05 — 26 November 2007 High-speed switching diodes 0.5 mm [1] Marking code A7* A1* S5 A1* ...
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... BAV756S T BAW56 T BAW56M T BAW56S T BAW56T T BAW56W T junction temperature ambient temperature storage temperature Thermal characteristics Parameter thermal resistance from junction to ambient BAW56 BAW56M BAW56W Rev. 05 — 26 November 2007 High-speed switching diodes Min - [ [ ...
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NXP Semiconductors Table 7. Symbol R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. 7. Characteristics Table unless otherwise specified. ...
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NXP Semiconductors (mA (1) (2) (3) ( 0.2 0.6 ( 150 C amb ( amb ( amb ( ...
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NXP Semiconductors 8. Test information D.U. ( Input signal: reverse pulse rise time t Oscilloscope: rise time t = 0.35 ns ...
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... Dimensions in mm Fig 9. Package outline BAV756S and BAW56S (SOT363/SC-88) Fig 11. Package outline BAW56W (SOT323/SC-70) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 1.1 0.9 0.45 0.15 2 0.48 0.15 0.38 0.09 04-11-04 Dimensions in mm Fig 8. Package outline BAW56M (SOT883/SC-101) 1.1 0.8 0.45 4 0.15 1.75 1.45 3 0.3 0.25 0.2 0.10 06-03-16 Dimensions in mm Fig 10. Package outline BAW56T (SOT416/SC-75) 2.2 1.8 3 2.2 1.35 2.0 1. ...
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... NXP Semiconductors 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAV756S BAW56 BAW56M BAW56S BAW56T BAW56W [1] For further information and the availability of packing methods, see [2] T1: normal taping [3] T2: reverse taping 11. Soldering Fig 12. Refl ...
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... NXP Semiconductors 4.60 Fig 13. Wave soldering footprint BAW56 (SOT23/TO-236AB) Fig 14. Reflow soldering footprint BAW56M (SOT883/SC-101) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 3.40 1.20 (2x) 2 4.00 1.20 3 2.80 4. 0.05 ( 0.90 0. solder lands solder paste Reflow soldering is the only recommended soldering method. Rev. 05 — 26 November 2007 ...
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NXP Semiconductors Fig 15. Reflow soldering footprint BAV756S and BAW56S (SOT363/SC-88) Dimensions in mm Fig 16. Wave soldering footprint BAV756S and BAW56S (SOT363/SC-88) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.35 solder lands 0.50 solder paste (4 ) solder resist ...
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NXP Semiconductors Fig 17. Reflow soldering footprint BAW56T (SOT416/SC-75) Fig 18. Reflow soldering footprint BAW56W (SOT323/SC-70) Fig 19. Wave soldering footprint BAW56W (SOT323/SC-70) BAV756S_BAW56_SER_5 Product data sheet BAV756S; BAW56 series 2.0 0.85 0.6 (3x) Dimensions in mm 2.65 0.75 1.325 ...
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... Product data sheet The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Type number BAW56M added Section 1.1 “General description”: amended Table 1 “Product overview” ...
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NXP Semiconductors 13. Legal information 13.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 15. Contents 1 Product profi 1.1 General description ...