NBSG16 ON Semiconductor, NBSG16 Datasheet - Page 2

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NBSG16

Manufacturer Part Number
NBSG16
Description
Manufacturer
ON Semiconductor
Datasheet

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Table 1. Pin Description
1. The NC pins are electrically connected to the die and MUST be left open.
2. All V
3. In the differential configuration when the input termination pins (VTD, VTD) are connected to a common termination voltage, and if no signal
A1,D1,A4,
B3,C3
A2,A3
BGA
bottom (see case drawing) must be attached to a heat-sinking conduit.
is applied then the device will be susceptible to self-oscillation.
N/A
C2
C1
B1
B2
D4
B4
C4
D3
D2
C
D
CC
A
B
Figure 1. BGA-16 Pinout (Top View)
Pin
and V
5,8,13,16
V
V
D
D
EE
EE
QFN
9,12
1
EE
6,7
10
11
14
15
1
2
3
4
-
pins must be externally connected to Power Supply to guarantee proper operation. The thermally exposed pad on package
VTD
VTD
V
NC
BB
2
Name
VTD
VTD
V
V
V
V
NC
EP
D
D
Q
Q
MM
CC
EE
BB
V
V
V
NC
MM
CC
CC
3
LVCMOS, LVDS,
LVCMOS, LVDS,
RSECL Output
RSECL Output
LVTTL Input
LVTTL Input
ECL, CML,
ECL, CML,
V
V
4
Q
Q
I/O
EE
EE
-
-
-
-
-
-
-
-
Internal 50 W Termination Pin. See Table 2.
Inverted Differential Input. Internal 75 kW to V
Noninverted differential input. Internal 75 kW to V
Internal 50 W Termination Pin. See Table 2.
Negative Supply Voltage
No Connect
Positive Supply Voltage
Noninverted Differential Output. Typically Terminated with 50 W to
V
Inverted Differential Output. Typically Terminated with 50 W to V
LVCMOS Reference Voltage Output. (V
ECL Reference Voltage Output
Exposed Pad. (Note 2)
http://onsemi.com
TT
= V
NBSG16
CC
- 2 V
2
VTD
VTD
D
D
Figure 2. QFN-16 Pinout (Top View)
1
2
3
4
V
V
16
EE
5
EE
Description
V
15
NC
NBSG16
BB
6
CC
V
14
NC
MM
7
- V
EE
EE
V
V
13
and 36.5 kW to V
8
EE
)/2
EE
EE
.
12
10
11
9
V
Q
Q
V
CC
CC
Exposed Pad (EP)
TT
CC
= V
.
CC
- 2 V

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