bgy205 NXP Semiconductors, bgy205 Datasheet - Page 9

• Manufacturer Part Number: bgy205
• Description: Uhf Amplifier Module
• Manufacturer: NXP Semiconductors

Cleaning
The following fluids may be used for cleaning:
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
Philips Semiconductors
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Footprints for soldering should cover the module contact
area +0.1 mm on all sides.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 C and damage the module.
The maximum temperature profile and soldering time is
indicated as follows (see Fig.18):
1996 May 21
t = 350 s at 100 C
t = 300 s at 125 C
t = 200 s at 150 C
t = 100 s at 175 C
t = 50 s at 200 C
t = 5 s at 250 C (maximum temperature).
Alcohol
Bio-Act (Terpene Hydrocarbon)
Triclean B/S
Acetone.
UHF amplifier module
9
handbook, halfpage
T mb
( C)
Fig.18 Maximum allowable temperature profile.
o
300
200
100
0
0
100
200
Product specification
300
BGY205
t (s)
MLB740
400