bgy282-n NXP Semiconductors, bgy282-n Datasheet - Page 10

• Manufacturer Part Number: bgy282-n
• Description: Bgy282 Dual Band Uhf Amplifier Module For Gsm900 And Gsm1800
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINE
2002 Apr 9
Leadless surface mounted package; plastic cap; 12 terminations
Dual band UHF amplifier module for GSM900 and
GSM1800
DIMENSIONS (mm are the original dimensions)
UNIT
12
mm
Z D (2×)
OUTLINE
VERSION
SOT632A
b (8×)
1.8
1.4
A
pin 1 index
11
1
(4×)
1.5
1.4
e
b
3.75
3.65
Dimensions of terminations
10
b 1
2
(4×)
0.61
0.49
e 1
c
0
IEC
14.05
13.45
b 1 (4×)
D
D 1
D
3
9
13.35
13.05
D 1
8.3
7.7
E
JEDEC
scale
7.85
7.55
E 1
4
8
5
REFERENCES
2.1
e
5
7
3.275
e 1
6
(12×)
(2×)
4.0
e 2
e 2
L
EIAJ
c
10
10 mm
(4×)
Z 7
1.45
1.35
L
A
Z 8
3.75
3.65
Z
1.55
1.45
Z D
Z 9
2.45
2.35
Z 1
Dimensions of solderresist
1.55
1.45
E 1
Z 2
E
1.35
1.25
Z 3
Z (2×)
(2×)
Z 3
PROJECTION
EUROPEAN
0.75
0.65
Z 4
0.7
0.6
Z 5
Preliminary specification
0.625
0.525
Z 6
Z 5 (4×)
(4×)
Z 1
1.55
1.45
ISSUE DATE
BGY282
Z 7
01-09-26
01-11-20
0.75
0.65
Z 8
SOT632A
Z 6 (4×)
0.85
0.75
(6×)
Z 9
Z 2
(8×)
Z 4