pbsm5240pf NXP Semiconductors, pbsm5240pf Datasheet
pbsm5240pf
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pbsm5240pf Summary of contents
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... PBSM5240PF PNP low V Trench MOSFET Rev. 1 — 25 August 2010 1. Product profile 1.1 General description Combination of PNP low V N-channel Trench MOSFET. The device is housed in a small and ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Very low collector-emitter saturation voltage V ...
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... Package Name Description HUSON6 Plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 × 2 × 0.65 mm Marking codes All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module Min Typ [ [4] - ...
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... T amb source current T amb junction temperature ambient temperature storage temperature All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module Min - - - [1] - [1] - [1] - [1] - ≤ 25 °C ...
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... 100 MHz = − collector capacitance MHz ≤ 300 μs; δ ≤ 0.02. p All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module Conditions Min Typ [1] in free air - - [2] in free air ...
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... R G fall time source-drain voltage I S ≤ 300 μs; δ ≤ 0.01. p All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module Min = 10 μ ° −55 °C ...
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... NXP Semiconductors 8. Package outline Fig 1. 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package PBSM5240PF SOT1118 [1] For further information and the availability of packing methods, see PBSM5240PF Preliminary data sheet 2.1 1.9 1.1 0.9 0.77 0.57 3 (2×) 2 ...
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... Reflow soldering is the only recommended soldering method. Reflow soldering footprint SOT1118 All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module 0.3 0.4 (6×) (6×) 1.05 1.15 (2×) (2×) Dimensions in mm © NXP B.V. 2010. All rights reserved. ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date PBSM5240PF v.1 20100825 PBSM5240PF Preliminary data sheet PNP BISS/Trench MOSFET module Data sheet status Preliminary data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF ...
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... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module © NXP B.V. 2010. All rights reserved ...
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... Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 1 — 25 August 2010 PBSM5240PF PNP BISS/Trench MOSFET module © NXP B.V. 2010. All rights reserved ...
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... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 25 August 2010 Document identifier: PBSM5240PF ...