tga2508-epu TriQuint Semiconductor, tga2508-epu Datasheet - Page 8

• Manufacturer Part Number: tga2508-epu
• Description: 12-19 Vsat Amplifier
• Manufacturer: TriQuint Semiconductor

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
1.020
(0.040)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice
0.599
(0.024)
0.396
(0.016)
0.120
(0.005)
0.801
(0.032)
TriQuint Semiconductor Texas: Phone [phone] Fax [phone] Web: www.triquint.com
0.118
(0.005)
1
0.145
(0.006)
2
* Note: RF GND is back side of MMIC.
Units: millimeters (inches)
Thickness: 0.100 (0.004)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size tolerance: +/- 0.051 (0.002)
Bond pad #1:
Bond pad #2:
Bond pad #3:
Bond pad #4:
Bond pad #5:
Bond pad #6:
Mechanical Drawing
(RF In)
(Vg)
(DC GND)*
(RF Out)
(DC GND)*
(Vd)
0.098 x 0.199
0.099 x 0.099
0.098 x 0.099
0.099 x 0.198
0.098 x 0.198
0.202 x 0.098
Advance Product Information
(0.004 x 0.008)
(0.004 x 0.004)
(0.004 x 0.004)
(0.004 x 0.008)
(0.004 x 0.008)
(0.008 x 0.004)
1.784
(0.070)
6
TGA2508-EPU
1.982
(0.078)
1.984
(0.078)
August 4, 2004
4
3
5
2.108
(0.083)
0.333
(0.013)
0.536
(0.021)
0.119
(0.005)
0.738
(0.029)
0.970
(0.038
1.138
(0.045)
8