buk7511 NXP Semiconductors, buk7511 Datasheet - Page 4

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buk7511

Manufacturer Part Number
buk7511
Description
Buk7511-55a; Buk7611-55a Trenchmos Tm Standard Level Fet
Manufacturer
NXP Semiconductors
Datasheet

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7. Thermal characteristics
Table 4:
Philips Semiconductors
9397 750 07817
Product specification
Symbol
R
R
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
th(j-a)
th(j-mb)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to mounting
base
7.1 Transient thermal impedance
Z th(j-mb)
10 -3
(K/W)
10 -1
10 -2
1
10 -6
= 0.5
10 -5
Rev. 01 — 1 February 2001
10 -4
BUK7511-55A; BUK7611-55A
Conditions
vertical in still air; SOT78 package
mounted on printed circuit board;
minimum footprint; SOT404
package
Figure 4
10 -3
10 -2
P
TrenchMOS™ standard level FET
10 -1
t p
T
t p (s)
03nd27
=
t p
T
t
© Philips Electronics N.V. 2001. All rights reserved.
1
Value
60
50
0.9
Unit
K/W
K/W
K/W
4 of 15

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