ipb06n03lbg Infineon Technologies Corporation, ipb06n03lbg Datasheet - Page 2

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ipb06n03lbg

Manufacturer Part Number
ipb06n03lbg
Description
N-channel Mosfet 20v?300v Power Transistor Power Mosfet
Manufacturer
Infineon Technologies Corporation
Datasheet
Rev. 0.93
2)
3)
4)
5)
connection. PCB is vertical in still air.
Parameter
Thermal characteristics
Thermal resistance, junction - case
SMD version, device on PCB
Electrical characteristics, at T
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
Gate-source leakage current
Gate resistance
Transconductance
Current is limited by bondwire; with an R
See figure 3
T
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
j,max
=150 °C and duty cycle D <0.25 for V
j
=25 °C, unless otherwise specified
thJC
Symbol Conditions
R
R
V
V
I
I
R
R
g
DSS
GSS
GS
fs
(BR)DSS
GS(th)
=1.8 K/W the chip is able to carry 86 A.
thJC
thJA
DS(on)
G
<-5 V
minimal footprint
6 cm
V
V
V
T
V
T
V
V
V
|V
I
D
page 2
j
j
GS
DS
DS
DS
GS
GS
GS
=25 °C
=125 °C
=30 A
DS
=V
=30 V, V
=30 V, V
=0 V, I
=20 V, V
=4.5 V, I
=10 V, I
|>2|I
2
cooling area
GS
, I
D
2
|R
D
(one layer, 70 µm thick) copper area for drain
D
=1 mA
D
=40 µA
D
GS
GS
DS
DS(on)max
=50 A
=30 A
=0 V,
=0 V,
=0 V
5)
,
min.
1.2
30
-
-
-
-
-
-
-
-
-
-
Values
typ.
1.6
0.1
7.4
5.3
1.2
10
10
58
-
-
-
-
IPB06N03LB
max.
100
100
1.8
9.3
6.3
62
40
2
1
-
-
-
Unit
K/W
V
µA
nA
mΩ
S
2006-05-10

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