ppc440epx-nta667t ETC-unknow, ppc440epx-nta667t Datasheet - Page 70

• Manufacturer Part Number: ppc440epx-nta667t
• Description: Mpu 440epx Risc 32-bit 0.13um 667mhz 1.8v/2.5v/3.3v 680-pin Tebga Tray
• Manufacturer: ETC-unknow

440EPx – PPC440EPx Embedded Processor
Table 17. Package Thermal Specifications
Thermal resistance values for the TE-PBGA package in a convection environment at 6.3W are as follows:
Thermal Management
The following heat sink was used in the above thermal analysis:
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sink is manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: [phone]
70
Junction-to-ambient thermal resistance
without heat sink
Junction-to-ambient thermal resistance
with heat sink
Junction-to-case thermal resistance
Junction-to-board thermal resistance
Notes:
1. Case temperature, T
2. T
3. T
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package).
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
A
CMax
= T
=
C
− P
T
Parameter
JMax
×θ
− P
CA
, where T
×θ
C
JC
, is measured at top center of case surface with device soldered to circuit board.
, where T
A
is ambient temperature and P is power consumption.
JMax
is maximum junction temperature (+125°C) and P is power consumption.
Symbol
θ
θ
θ
θ
JA
JA
JC
JB
13.1
11.1
(0)
0
(0.51)
11.7
100
8.2
Resistance Value
(1.02)
10.9
200
7.2
Airflow
(m/sec)
ft/min
3.5
7.3
(1.53
10.5
300
6.8
Revision 1.30 – February 27, 2009
(2.04)
10.3
400
6.6
(2.55)
500
6.3
10
Data Sheet
AMCC Proprietary
°C/W
°C/W
°C/W
°C/W
Unit
Notes
5, 6
5
5
5